Thermally Controlled Lid Stack Components for Semiconductor Processing
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Solution Overview
Problem
Semiconductor processing systems face challenges in achieving uniform heat distribution across multiple processing chambers, leading to temperature skews and inefficiencies in heat transfer, which can affect the quality of semiconductor devices.
Innovation Solution
The design incorporates a substrate processing system with vertically aligned transfer sections and separate lid stacks for each processing region, featuring an asymmetric choke plate and thermally floating components to improve heat distribution symmetry and reduce heat losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If components within the system are coupled together, then structural integrity is maintained, but heat transfer uniformity deteriorates due to non-uniform heat transfer between components
Solution Approach 1:
The lid stack is divided into separate components (lid plate, choke plate, faceplate, pumping liner) that are thermally isolated from each other. This segmentation allows each component to be independently temperature-controlled, resolving the contradiction by preventing non-uniform heat transfer while maintaining structural integrity through mechanical coupling only.
Solution Approach 2:
The choke plate acts as a thermal intermediary or mediator between the lid plate and faceplate. By positioning the choke plate with its first aperture aligned with the lid plate aperture and second aperture aligned with the faceplate aperture, it controls and uniformizes the heat transfer path, ensuring uniform temperature distribution while maintaining structural connection.
2Device complexity
If traditional coupled component design is used, then device complexity is reduced, but manufacturing precision deteriorates due to temperature skews affecting processing quality
Solution Approach 1:
The processing chamber is segmented into multiple independently controllable zones (lid plate region, choke plate region, faceplate region) with distinct thermal management. This allows precise temperature control in each region, improving manufacturing precision while the modular design keeps device complexity manageable.
Solution Approach 2:
Different regions of the lid stack are given different thermal properties and control strategies. The lid plate, choke plate, and faceplate each have localized heating/cooling capabilities tailored to their specific processing requirements, enabling high manufacturing precision through localized temperature optimization.
3Temperature
If uniform heat distribution is achieved across processing chambers, then processing quality improves, but energy consumption increases due to additional thermal control requirements
Solution Approach 1:
The thermal control system is segmented into independent zones (lid plate, choke plate, faceplate) that can be controlled separately. This allows energy to be applied only where needed and at the required temperature levels, achieving uniform heat distribution while minimizing total power consumption through targeted thermal management.
Solution Approach 2:
The system dynamically adjusts temperature parameters in different regions based on processing requirements. By changing temperature setpoints and heating/cooling rates independently in each zone, the system achieves uniform heat distribution efficiently, consuming only the necessary energy for each specific processing task.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat transfer uniformity across the faceplate, reduces power consumption, and maintains consistent temperature patterns, improving the quality and efficiency of semiconductor processing.
Implementation Method 1
a faceplate heater seated on the faceplate and positioned radially outward of the blocker plate
Implementation Method 2
The heat may extend through components of the lid stack. Depending on the coupling of components within the system, the heat transfer may not be uniform between components.
Data Source
AI summary
Exemplary substrate processing systems may include chamber body defining a transfer region. The systems may include a lid plate seated on the chamber body. The lid plate may define a first plurality of apertures through the lid plate and a second plurality of apertures through the lid plate. The systems may include a plurality of lid stacks equal to a number of apertures of the first plurality of apertures defined through the lid plate. Each lid stack of the plurality of lid stacks may include a choke plate seated on the lid plate along a first surface of the choke plate. The choke plate may define a first aperture axially aligned with an associated aperture of the first plurality of apertures. The choke plate may define a second aperture axially aligned with an associated aperture of the second plurality of apertures.