Thermally Decoupled Component for High-Temperature Bus Bars
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Solution Overview
Problem
Components used in automotive applications, such as EMC filters, face challenges in being lightweight, insensitive to high temperatures, and resistant to vibrations, while existing designs often fail to effectively decouple thermal and mechanical stresses between regions.
Innovation Solution
A component design featuring a first region for bus bar feedthrough and a second region with discrete devices, separated by a cooling region that thermally decouples the two, using a housing with a cooling region filled with thermal insulators like air or plastics to manage heat and mechanical decoupling via cables or PCBs to absorb vibrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the component is designed to be lightweight and miniaturized, then weight and size are reduced, but thermal insulation performance deteriorates
Solution Approach 1:
The patent applies local quality by creating a specific thermal insulation structure in the transition region between the high-temperature bus bar area and the low-temperature component area. The transition region includes an insulating barrier and an air gap, which are localized thermal insulation measures designed specifically at the heat transfer path. This allows the overall component to remain compact and lightweight while providing sufficient thermal insulation where needed most.
2Adaptability or versatility
If the component is exposed to high temperatures and vibrations, then operational capability in harsh environments is improved, but reliability deteriorates due to thermal and mechanical stress
Solution Approach 1:
The patent applies segmentation by dividing the component into distinct thermal zones: a high-temperature region for the bus bar, a transition region with thermal insulation structures, and a low-temperature region for sensitive components. This spatial segmentation creates thermal decoupling, allowing the component to operate in harsh high-temperature environments while protecting sensitive parts from thermal and mechanical stress, thereby maintaining reliability.
Solution Approach 2:
The patent uses the transition region as an intermediary structure between the high-temperature bus bar and the low-temperature component area. This intermediary includes insulating barriers and air gaps that mediate heat transfer, reducing thermal stress on sensitive components while allowing the component to function in harsh environments.
3Temperature
If thermal decoupling is implemented between regions, then temperature protection is improved, but device complexity increases
Solution Approach 1:
The patent implements thermal decoupling with relatively simple structures by focusing insulation measures locally in the transition region rather than throughout the entire component. The insulating barrier and air gap are positioned specifically where heat transfer occurs, providing effective temperature protection without requiring complex insulation systems across the whole device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures the discrete devices remain cool and protected from excessive temperatures and vibrations, allowing for the use of components with very hot bus bars without temperature limits, while maintaining miniaturization and preventing mechanical damage.
Implementation Method 1
a cooling region, which thermally decouples the first region from the second region
Data Source
AI summary
A component is disclosed. In an embodiment a component includes a first region suitable for a feedthrough of at least one bus bar and a second region in which at least one discrete device is arranged, wherein the first region and the second region are separated from one another by a cooling region thermally decoupling the first region from the second region.