Thermally Enhanced Immersion Cooling Structure for PCB Hot Spots
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing immersion cooling systems for high-performance computing equipment face inefficiencies due to static or low flow rates of coolant near high-temperature devices, leading to less-effective heat dissipation.
Innovation Solution
The implementation of coolant outlets with adjustable nozzles and manifold valves to direct pressurized coolant flow specifically to high-temperature devices, coupled with a closed-loop system for dual-phase immersion cooling to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional immersion cooling systems are used with static coolant flow, then the system structure is simple, but heat dissipation efficiency is insufficient near high-temperature devices
Solution Approach 1:
The patent implements localized coolant delivery through outlets positioned near specific high-temperature devices, with nozzles directing coolant precisely to hot spots. This creates non-uniform coolant flow distribution matched to local heat generation patterns, resolving the contradiction by making the cooling system locally optimized rather than uniformly simple.
Solution Approach 2:
The patent introduces adjustable nozzles and flow control valves that allow dynamic adjustment of coolant flow rates and directions. This enables the system to adapt coolant distribution to varying thermal conditions, improving heat dissipation efficiency while maintaining reasonable structural complexity through controlled adjustability.
2Productivity
If coolant flow rate is increased to improve heat dissipation, then heat transfer effectiveness improves, but energy consumption increases
Solution Approach 1:
The patent delivers coolant at high flow rates only to specific locations near high-temperature devices where heat dissipation is most needed, rather than uniformly increasing flow throughout the entire system. This localized high-velocity delivery improves heat transfer effectiveness at hot spots while minimizing overall energy consumption.
Solution Approach 2:
The patent applies excessive coolant flow (high velocity) locally at critical hot spots rather than uniformly across the entire system. This partial application of excessive action achieves superior heat transfer where needed while avoiding the energy penalty of system-wide high flow rates.
3Productivity
If targeted coolant delivery is implemented with adjustable nozzles and valves, then heat dissipation efficiency improves, but device complexity increases
Solution Approach 1:
The patent implements targeted coolant delivery with adjustable nozzles and flow control valves positioned at specific locations near high-temperature devices. This localized complexity is concentrated only where heat dissipation challenges exist, achieving improved heat transfer efficiency without requiring complex systems throughout the entire cooling infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves heat dissipation efficiency by ensuring targeted coolant delivery and continuous phase change for enhanced heat absorption, effectively managing high heat loads in computing environments.
Implementation Method 1
the heat is directly transferred to the surrounding liquid
Implementation Method 2
The heated liquid naturally rises and is replaced by cooler liquid in a convection cycle
Implementation Method 3
in this method, the liquid is chosen for its low boiling point, allowing it to boil when it comes into contact with the hot components. The phase change from liquid to vapor effectively absorbs a significant amount of heat
Implementation Method 4
the liquid is chosen for its low boiling point, allowing it to boil when it comes into contact with the hot components
Implementation Method 5
When the vapor comes into contact with the cooler surface of the condenser, it releases its latent heat and changes phase back into a liquid
Data Source
AI summary
A memory device for use in immersion cooling comprises a printed circuit board, one or more surface-mounted devices coupled to the printed circuit board, and one or more coolant outlets coupled to the printed circuit board to deliver coolant to the one or more surface-mounted devices. A system for cooling electronic devices comprises a tank for receiving a coolant liquid into which the electronic devices can be immersed in use, a manifold comprising a fluid inlet coupleable to a supply of pressurized coolant and a plurality of spigots to deliver coolant liquid to coolant outlets located at or on printed circuit board.