Thermally Expandable Sheet Simulation for Heat Conduction

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Solution Overview

Problem

Existing techniques for forming shaped objects using thermally expandable sheets face challenges in precisely estimating expansion height due to heat conduction issues, leading to inaccuracies in predicting the actual expansion of the medium.

Innovation Solution

A simulation method is developed that sets the density of a conversion layer on a thermally expandable sheet, derives the temperature of the conversion layer upon irradiation, executes simulations for heat conduction along the sheet's surface, and corrects temperatures to accurately estimate the expansion height based on heat conduction conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If heat conduction is considered in the medium during heating, then the temperature distribution becomes more accurate, but the expansion height estimation becomes less accurate due to heat loss

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidexpansion height estimation accuracy
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The patent introduces a simulation device as an intermediary between the heating process and the expansion height estimation. This simulation device calculates the temperature distribution considering heat conduction, then uses this information to determine the actual expansion height more accurately, mediating between the thermal field and the mechanical expansion response

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the parameter consideration from simple uniform heating to spatially varying temperature distribution. By incorporating heat conduction parameters and position-dependent temperature calculations, the system adjusts the temperature parameter to reflect actual physical conditions, thereby improving expansion height prediction

Inventive Principle:
Principle #35Parameter changes

2Use of energy by moving object

If the conversion layer density is increased to improve heating efficiency, then the temperature rise is faster, but the heat conduction losses increase leading to greater temperature deviation from expected values

Engineering Contradiction:
Improveheating efficiencyVSAvoidtemperature control reliability
Core Design Contradiction:
Use of energy by moving objectVSReliability

Solution Approach 1:

The patent implements a feedback mechanism where the simulation device continuously calculates the temperature distribution based on heat conduction equations and compares it with the target temperature profile. This feedback information is used to adjust the heating parameters and predict the actual expansion outcome, ensuring reliable temperature control despite heat losses

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for precise estimation of the expansion height of thermally expandable sheets, improving the accuracy of shaped object formation by accounting for heat conduction effects.

Implementation Method 1

a conversion layer which is formed in a medium which has a thermal expansion layer which expands with heat and converts electromagnetic waves into heat

Methodology Applied
Scientific EffectElectromagnetic wave conversion to heat: Absorption (EM radiation)

Implementation Method 2

a thermal expansion layer which expands with heat

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 3

executing a simulation relating to heat conduction which takes place in a direction along a surface of the medium in the medium

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS11373021B2Simulation method, computer-readable storage medium and simulation device
Publication Date: 2022.06.28 CASIO COMPUTER CO LTD
  • US11373021B2 patent drawing
  • US11373021B2 patent drawing
  • US11373021B2 patent drawing

AI summary

A simulation method includes setting a density of a conversion layer which is formed in a medium which has a thermal expansion layer which expands with heat and converts electromagnetic waves into heat, deriving a temperature of the conversion layer which is obtained in a case where the conversion layer which has the set density is irradiated with the electromagnetic waves, executing a simulation relating to heat conduction which takes place in a direction along a surface of the medium in the medium on the basis of a condition which is defined in accordance with the medium and correcting the derived temperature on the basis of a result of execution of the simulation, and deriving an expansion height up to which the medium expands in a case where the medium is heated at the corrected temperature.