Thermally Insulated Gate Segments for High-Load Stability

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Solution Overview

Problem

Existing door systems, particularly horizontally opening gates like sliding and folding gates, face challenges in achieving sufficient thermal insulation while maintaining structural stability, especially when subjected to high loads during opening and closing, limiting their size and frequency of use.

Innovation Solution

A door segment design featuring a single-piece profile frame with thermal insulation applied on one or both outer surfaces, where hinges and other load-bearing parts are directly attached, ensuring the insulation extends continuously around the frame circumference, except at hinge locations, enhancing stability and insulation without compromising structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If two metal profile halves are connected via a thermal break to achieve thermal insulation, then the thermal insulation of the frame construction is improved, but the structural strength and stability of the gate leaf deteriorate under high loads

Engineering Contradiction:
Improvethermal insulationVSAvoidstructural strength
Core Design Contradiction:
TemperatureVSStrength

Solution Approach 1:

The gate frame is segmented into multiple functional layers: an outer metal profile for structural strength, an intermediate thermal insulation layer for thermal insulation, and an inner metal profile for additional strength. This segmentation allows each layer to perform its primary function independently while working together as a unified structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The frame construction uses a composite structure combining metal profiles with thermal insulation material (such as polyamide or foam). The metal provides mechanical strength while the insulation material provides thermal resistance, creating a composite that achieves both structural and thermal performance requirements simultaneously.

Inventive Principle:
Principle #40Composite materials

2Temperature

If a thermal break construction is used to improve thermal insulation, then the thermal insulation value is improved, but the manufacturing complexity and effort increase

Engineering Contradiction:
Improvethermal insulation valueVSAvoidmanufacturing effort
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The thermal insulation layer is integrated directly into the profile structure during manufacturing, merging the insulation function with the frame construction. This eliminates the need for separate assembly steps to attach thermal breaks, reducing manufacturing complexity while maintaining insulation performance.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The multi-layer profile design serves multiple functions simultaneously: the outer and inner metal profiles provide structural support and mounting surfaces, while the intermediate layer provides thermal insulation. This multi-functionality reduces the need for additional components and simplifies the overall manufacturing process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of operation

If hinges are attached alternately on the outside and inside of a thermally separated frame structure, then the gate can be assembled, but the force flow under load passes through the thermal break, reducing gate leaf strength

Engineering Contradiction:
Improvegate assemblyVSAvoidgate leaf strength under load
Core Design Contradiction:
Ease of operationVSStrength

Solution Approach 1:

The hinge attachment areas are designed with local reinforcement features directly on the metal profiles, concentrating the load-bearing capacity at specific locations where hinges are mounted. This local quality enhancement ensures that force flows through the strong metal profile sections rather than through the thermal break materials.

Inventive Principle:
Principle #3Local quality

4Ease of manufacture

If the frame construction is designed without thermal insulation to simplify manufacturing, then the manufacturing complexity is reduced, but the thermal insulation performance of the door system deteriorates

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidthermal insulation performance
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The thermal insulation layer is pre-integrated into the profile structure during the manufacturing process rather than being added as a separate post-assembly component. This preliminary action ensures thermal insulation is built-in from the start, maintaining insulation performance while keeping the manufacturing process streamlined.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides improved thermal insulation comparable to prior art methods while significantly increasing structural stability, allowing for larger and more frequently used gate systems with reduced manufacturing complexity and cost.

Implementation Method 1

the insulation, with the exception of the hinge elements, extends essentially in a closed manner over the circumference of the profile frame

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentEP4517039B1Gate segment for forming a one-piece or multi-piece gate
Publication Date: 2025.10.08 AUROPORT GMBH SRL
  • EP4517039B1 patent drawingFigure 1~2
  • EP4517039B1 patent drawingFigure 3~4
  • EP4517039B1 patent drawingFigure 5~6

AI summary

A gate segment (10) for forming a single or multi-part gate (100) has a profile frame (20) which defines a segment plane (E) and is fitted with at least one panel (25, 29), wherein the profile frame (20) is provided with thermal insulation (30) on at least one outer surface (21, 23) of the gate segment (10) with respect to the segment plane (E).