Thermally Softenable Cover for Multi-Level Power Electronics Mounting

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Solution Overview

Problem

The mounting of power electronics components on substrates using sintered connections is complex and requires additional manufacturing effort, and existing methods do not effectively manage manufacturing tolerances and thermal stability across different joining levels.

Innovation Solution

A method involving a cover with integrated conductor paths made from thermally softenable or hardenable material, where the cover is placed on the substrate and heated to bridge two joining levels, allowing for simultaneous formation of joining connections across different planes, thereby simplifying the mounting process and enhancing thermal stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If sintered connections are used to mount power electronics components on substrates, then reliable electrical connections are achieved, but the manufacturing process becomes complex and requires additional manufacturing effort

Engineering Contradiction:

Improveconnection reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple joining operations at different joining levels into a single sintering process. The tool allows simultaneous application of pressure and heat to form sintered connections at multiple levels (first joining level on substrate, second joining level on component top side) in one manufacturing step, thereby reducing process complexity while maintaining connection reliability

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The sintering tool is designed with universal functionality to handle multiple joining levels and different component configurations. The tool can accommodate various component heights and positions while performing the same sintering operation, making the manufacturing process more versatile and less complex

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If components are mounted at different joining levels, then three-dimensional integration is achieved, but manufacturing tolerances become more difficult to manage

Engineering Contradiction:

Improvethree-dimensional integrationVSAvoidtolerance management

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The sintering process utilizes parameter changes (temperature and pressure) to accommodate manufacturing tolerances. The thermal and mechanical energy applied during sintering allows for compensation of dimensional variations, enabling precise joining connections even when components are positioned at different levels with inherent manufacturing tolerances

Inventive Principle:

Principle #35Parameter changes

3Reliability

If multiple joining levels are used, then functional integration is improved, but thermal stability across different planes becomes challenging to maintain

Engineering Contradiction:

Improvefunctional integrationVSAvoidthermal stability

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The sintering process creates equipotential thermal conditions across all joining levels simultaneously. By applying uniform heat and pressure throughout the assembly, the process ensures that all joining connections (at first and second joining levels) experience equivalent thermal conditions, thereby maintaining thermal stability across different planes

Inventive Principle:

Principle #12Equipotentiality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method simplifies the mounting process by bridging different joining levels and improving manufacturing tolerances, reducing the complexity of forming connections across various planes, and enhancing the thermal stability of power electronics assemblies.

Implementation Method 1

the cover is composed of a thermally softenable or thermally hardenable material, wherein the cover, during the mounting process, is placed onto the mounting side of the substrate... and wherein the material of the cover is, during the mounting process, heated at least into the softening range or into the hardening range

Methodology Applied

Scientific EffectThermal softening: Melting

Implementation Method 2

Methodology Applied

Scientific EffectThermal hardening: Heat Treatment

Implementation Method 3

DE 100 62 108 A1 describes that a power module can be formed in the case of which the electronic power components can be connected to the substrate by way of a sintered layer

Methodology Applied

Scientific EffectSintering: Sintering

Data Source

PatentUS10008394B2Method for mounting an electrical component, wherein a hood is used, and hood suitable for use in said method

Publication Date: 2018.06.26 SIEMENS AG

AI summary

A method for mounting an electrical component to a substrate may include mounting the component onto the substrate, forming a cover including a thermally softenable or hardenable material and a contacting structure defined by integrated conductor paths, mounting the cover onto a mounting side of the substrate and onto the component mounted on the substrate, such that (a) the cover laterally traverses the component, (b) first contact surfaces of the contacting structure engage with the substrate at a first joining level defined at the mounting side of the substrate, and (c) second contact surfaces of the contacting structure engage with the component at a second joining level at the top side of the component, the second joining level being different than the first joining level. After assembling the components, joining connections at the first and second joining levels may be completed by a temperature or pressure based joining process.