Thermistor Board Layout for Accurate Housing Temperature Detection
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Solution Overview
Problem
Conventional electronic devices face challenges in accurately measuring internal temperatures due to heat generated by components like processors, leading to inaccurate temperature sensing and potential safety issues, especially when there is a significant difference between internal and external temperatures.
Innovation Solution
The solution involves positioning thermistors on a second board separate from the main PCB, allowing for more accurate temperature measurement by minimizing direct contact with heat-generating components and using a second board to electrically connect with the first board, thereby enhancing temperature detection accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the thermistor is mounted on the main PCB together with other elements, then the device complexity is reduced, but the temperature measurement precision deteriorates due to heat interference from peripheral components
Solution Approach 1:
The patent divides the PCB into two separate boards: a first PCB for mounting heat-generating components (processor, memory) and a second PCB for mounting the thermistor. This segmentation isolates the temperature sensing function from heat-generating components, eliminating thermal interference while maintaining structural organization.
Solution Approach 2:
The thermistor is extracted from the first PCB and mounted on a separate second PCB. This extraction removes the thermistor from the thermal environment of heat-generating components, allowing accurate temperature measurement of the housing without being influenced by component heat.
2Device complexity
If the thermistor is positioned close to heat-generating components, then the device structure is simplified, but the temperature measurement accuracy deteriorates due to heat interference
Solution Approach 1:
The patent segments the device into functional zones: the first PCB contains heat-generating components, the second PCB contains the thermistor, and thermal insulation structures separate these zones. This spatial segmentation ensures the thermistor measures housing temperature without being influenced by component heat.
Solution Approach 2:
The patent introduces thermal insulation structures (insulation films, air gaps) as intermediaries between heat-generating components and the thermistor. These intermediaries block heat transfer paths, allowing the thermistor to accurately sense housing temperature without direct thermal coupling to components.
3Ease of manufacture
If a single board is used for both processing and temperature sensing, then the manufacturing process is simplified, but the temperature control effectiveness deteriorates due to inaccurate sensing
Solution Approach 1:
The patent divides the system into processing functions (first PCB) and sensing functions (second PCB with thermistor). This segmentation enables independent optimization of each function while maintaining manufacturing feasibility through standardized PCB assembly processes.
Solution Approach 2:
The separated thermistor provides accurate real-time temperature feedback of the housing to the processor, enabling reliable temperature control. The feedback loop is improved because the sensing data is no longer corrupted by thermal interference from components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise temperature sensing of the housing and battery, improving safety by providing real-time temperature feedback and enabling effective temperature control.
Implementation Method 1
a thermistor mounted on the second board, wherein the at least one processor measures a temperature of the housing based on an electrical signal received from the second board
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing configured to form an external shape thereof, a first board disposed in a first direction that is away from the housing, wherein at least one processor is mounted at the first board, a second board disposed between the housing and the first board and electrically connected with the first board, and a thermistor mounted on the second board, wherein the at least one processor measures a temperature of the housing based on an electrical signal received from the second board.