Thermistor Board Layout for Accurate Housing Temperature Sensing
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Solution Overview
Problem
Conventional electronic devices face challenges in accurately measuring internal temperatures due to thermistors being mounted with other components on the PCB, leading to inaccurate readings and discrepancies between internal and external temperatures, which can affect temperature control and user safety.
Innovation Solution
The electronic device is configured with a thermistor mounted on a second board separate from the main PCB, allowing for more accurate temperature measurement of the housing and battery by minimizing heat interference and physical contact, using a flexible printed circuit board (FPCB) for electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the thermistor is mounted on the main PCB together with other components, then the device complexity is reduced, but the measurement precision deteriorates due to heat interference from peripheral components
Solution Approach 1:
The patent divides the PCB into two separate boards: the main PCB for mounting heat-generating components (processor, memory) and a secondary PCB for mounting the thermistor. This segmentation isolates the temperature sensing function from heat-generating components, eliminating thermal interference and improving measurement precision without significantly increasing overall device complexity.
Solution Approach 2:
The thermistor is extracted from the main PCB and mounted on a separate secondary PCB. This extraction removes the thermistor from the thermal environment created by peripheral components, allowing it to accurately measure the temperature of the housing and battery without being affected by heat from the processor and memory.
2Measurement precision
If the thermistor is placed close to the housing for accurate measurement, then the measurement precision improves, but the thermistor may be affected by physical contact and external factors
Solution Approach 1:
The secondary PCB acts as an intermediary between the thermistor and the housing. The thermistor is mounted on the secondary PCB which is positioned close to the housing for accurate temperature measurement, while the PCB itself provides mechanical support and electrical connection, isolating the thermistor from direct physical contact with the housing and external factors.
3Measurement precision
If the thermistor is mounted on a separate board, then the measurement precision improves, but the device complexity increases
Solution Approach 1:
The patent combines multiple functions into the secondary PCB: it serves as the mounting substrate for the thermistor, provides electrical connection between the thermistor and main PCB, and acts as a structural support element. This merging of functions minimizes the increase in device complexity while achieving the goal of improved temperature measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise temperature sensing of the housing and battery, improving temperature control and user safety by reducing heat transfer and physical impacts on the thermistor, thus enhancing the accuracy of temperature feedback.
Implementation Method 1
a thermistor mounted on the second board, wherein the at least one processor measures a temperature of the housing based on an electrical signal received from the second board
Data Source
AI summary
An electronic device is provided. The electronic device includes a housing configured to form an external shape thereof, a first board disposed in a first direction that is away from the housing, wherein at least one processor is mounted at the first board, a second board disposed between the housing and the first board and electrically connected with the first board, and a thermistor mounted on the second board, wherein the at least one processor measures a temperature of the housing based on an electrical signal received from the second board.