Low-Temperature Thermistor Composite for Strong Electrode Bonding
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Solution Overview
Problem
Existing thin-film thermistors face issues with weak bonding between the metal oxide film and metal electrodes due to thermal expansion coefficient differences, leading to interfacial detachment, and low-quality films formed at low temperatures affect electrical characteristics, while cold sintering methods fail to produce high-density and strong sintered masses.
Innovation Solution
A composite of metal oxide particles with an amorphous phase containing metal elements like Mn or Ni, optionally with Fe, Al, or Co, and resin particles, sintered at low temperatures using metal acetylacetonate, forming a dense and strong thermistor layer with improved bonding to metal electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal oxide particles are sintered at high temperatures (400°C or above) to achieve high thermistor properties, then electrical characteristics are improved, but bonding strength between metal oxide film and metal electrodes deteriorates due to thermal expansion coefficient differences causing cracks and interfacial detachment
Solution Approach 1:
The patent changes the sintering temperature parameter from conventional high temperatures (400°C or above) to low temperatures (200°C or below) through cold sintering, fundamentally altering the processing conditions to resolve the contradiction between achieving good electrical characteristics and maintaining strong bonding
Solution Approach 2:
The patent introduces solvents (water and acid or alkali) as intermediaries that partially dissolve the oxide particles, enabling low-temperature sintering while maintaining particle bonding. This intermediary medium allows the sintering process to proceed at temperatures that do not cause thermal expansion mismatch damage
2Reliability
If conventional sintering methods are used to form high-quality metal oxide films, then electrical characteristics are improved, but manufacturing complexity and energy consumption increase due to high-temperature processing requirements
Solution Approach 1:
The patent fundamentally changes the sintering temperature parameter to below 200°C, which simplifies the manufacturing process by eliminating the need for complex high-temperature equipment and reducing energy consumption while still achieving functional metal oxide films with adequate electrical characteristics
Solution Approach 2:
The patent replaces the thermal energy-based sintering mechanism with a chemical dissolution-reprecipitation mechanism using solvents, substituting high-temperature thermal processing with a chemical process that occurs at low temperatures, thereby simplifying the manufacturing system
3Strength
If cold sintering is used to reduce processing temperature, then bonding strength is improved, but sintered mass density and strength are insufficient for Mn and Ni oxide particles
Solution Approach 1:
The patent applies the cold sintering process parameters (solvent type, concentration, heating temperature, pressure, time) that were successfully developed for other metal oxides to Mn and Ni oxides, adapting the proven low-temperature sintering methodology to these specific materials to achieve both adequate density and bonding strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite achieves desired electrical characteristics and strong bonding, reducing resistance variations under humid conditions, enabling high-temperature sensitivity and flexibility in thin-film thermistors.
Implementation Method 1
cold sintering (CS), by which metal oxide particles can be sintered at as low temperatures as 200° C. or below
Implementation Method 2
heating and pressed at 200° C. or below
Data Source
AI summary
A composite that includes multiple first metal oxide particles containing at least one metal element that is at least one of Mn or Ni, and a first amorphous phase between the multiple first metal oxide particles and which contains the at least one first metal element.