Thermistor Lead Wire Clamping for Manufacturing Yield

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Solution Overview

Problem

The existing manufacturing method for temperature sensors results in a low yield rate due to the thermistor element being held by lead wires with a weak force, causing it to dislodge during solder paste application and other processes.

Innovation Solution

The method involves disposing lead wires side by side, with the thermistor element positioned such that the distal ends of the lead wires extend along opposite sides of the element, forming corners that are supported by the lead wires, allowing for improved electrical connection and fixation, thereby increasing the clamping force and stability of the thermistor element.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the thermistor element is attached to one lead wire and supported by the distal end of the other lead wire, then the manufacturing process is simple, but the holding force is weak causing the thermistor element to dislodge

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidholding force of thermistor element
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent merges the functions of both lead wires to support the thermistor element. Both lead wires are configured to extend along side faces of the thermistor element, with their distal ends supporting opposite corners of the element. This combining of support functions from both lead wires creates a stable, rigid triangular support structure that prevents dislodging during manufacturing processes.

Inventive Principle:
Principle #5Merging (Combining)

2Device complexity

If the thermistor element is held with weak force by lead wires, then the device structure is simple, but the yield rate is low due to dislodging during solder paste application

Engineering Contradiction:
Improvestructure complexityVSAvoidyield rate
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent implements preliminary action by configuring both lead wires to extend along the side faces of the thermistor element before the solder paste application process. The distal ends of both lead wires are positioned to support opposite corners of the thermistor element in advance, creating a pre-established rigid support structure that prevents dislodging during subsequent manufacturing steps, thereby improving yield rate without adding complex structures.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentEP2896944B1Temperature sensor and manufacturing method for temperature sensor
Publication Date: 2018.01.31 MURATA MFG CO LTD
  • EP2896944B1 patent drawingFigure 1
  • EP2896944B1 patent drawingFigure 2
  • EP2896944B1 patent drawingFigure 3

AI summary

A manufacturing method for a temperature sensor includes a second disposing step and a fixing step. The second disposing step includes disposing a thermistor element so that the distal end portion of a first lead wire extends along a first side face and passes by the first side face, and the distal end portion of a second lead wire extends along a second side face. The fixing step includes electrically connecting and fixing the first lead wire to a first outer electrode, and electrically connecting and fixing the second lead wire to a second outer electrode, in a state in which a first corner and a second corner are respectively supported by the first lead wire and the second lead wire.