Thermistor Mounting Apparatus Segmented Substrates
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Solution Overview
Problem
Conventional thermistor mounting apparatuses face restrictions in wiring layer layout when both electronic components and thermistors are on the same substrate due to the need for electrical insulation, limiting miniaturization and flexibility in component placement.
Innovation Solution
The apparatus includes a base substrate with an insulating substrate and electrodes, allowing the thermistor to be electrically connected to the electrodes while maintaining insulation from the wiring layer, enabling flexible layout and miniaturization by using a thermal conductive layer and adhesive layer for secure mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the electronic component and thermistor are provided on the same substrate, then the device integration is improved, but the wiring layer layout is restricted due to electrical insulation requirements
Solution Approach 1:
The substrate is segmented into a first substrate for mounting the electronic component and a second substrate for mounting the thermistor. This segmentation allows independent wiring layer layouts on each substrate, eliminating the layout restrictions that would occur if both components shared the same substrate. The substrates are then bonded together to achieve device integration.
2Reliability
If the wiring layer is electrically insulated from the thermistor electrode, then electrical isolation is achieved, but the layout flexibility is reduced
Solution Approach 1:
The wiring layers are segregated onto different substrates - the first wiring layer on the first substrate and the second wiring layer on the second substrate. This spatial segmentation through substrate bonding achieves electrical isolation between the wiring layers while maintaining layout flexibility on each individual substrate, as each can be designed independently without constraining the other.
3Volume of moving object
If miniaturization is pursued, then the device size is reduced, but the wiring layer layout becomes more constrained
Solution Approach 1:
By dividing the device into two separate substrates that are bonded together, each substrate can be miniaturized independently with optimized wiring layouts. The first substrate accommodates the electronic component with its wiring, while the second substrate accommodates the thermistor with its wiring, allowing both to be compact without the wiring layers interfering with each other's routing.
Solution Approach 2:
The solution moves from a planar two-dimensional layout challenge to a three-dimensional stacked configuration. By bonding substrates in the vertical dimension, the wiring layers that would conflict in a flat layout are separated in space, enabling miniaturization without layout constraints while utilizing the third dimension for spatial organization.
Data Source
AI summary
In order to realize a thermistor on a base substrate without restricting the layout of a wiring layer, a thermistor mounting apparatus is provided, the thermistor mounting apparatus including a base substrate, and a thermistor component provided over the base substrate, in which the thermistor component has an insulating substrate, an electrode provided over the insulating substrate, and a thermistor provided over the insulating substrate and electrically connected to the electrode.