Thermistor Sensor Resilient Pad for Chipset Temperature Measurement
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Solution Overview
Problem
Existing chipset temperature measurement systems face challenges in directly connecting internal temperature sensors to System Management Controllers (SMC), leading to increased costs and installation time, and difficulty in adjusting sensor positions due to manual attachment methods.
Innovation Solution
A thermistor sensor assembly is placed between a heat sink and a printed circuit board (PCB), comprising a thermistor sensor, an electrical connector, and a resilient pad, which facilitates temperature measurement by compressing the sensing element against the heat sink, allowing for flexible positioning and adaptation to chipset layout changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual attachment methods are used to attach the thermistor sensor to the heat sink, then the sensor can be securely fixed for temperature measurement, but the installation cost and time increase
Solution Approach 1:
The patent introduces a resilient pad as an intermediary component between the thermistor sensor and the heat sink. This pad simplifies the attachment process by providing a compliant mounting surface that requires less precise alignment and fewer fastening steps compared to direct rigid attachment, thereby reducing installation time while maintaining secure sensor fixation
Solution Approach 2:
The resilient pad is implemented as a flexible thin film component that conforms to the heat sink surface. This flexibility allows for easier sensor attachment without requiring precise machining grooves or complex fastening mechanisms, reducing both installation time and cost while ensuring reliable thermal contact
2Measurement precision
If the thermistor sensor is tightly attached to the heat sink using screws, thermal conductive resin, and adhesive mylar, then accurate temperature measurement is achieved, but the sensor position becomes difficult to adjust when chipset layout is altered
Solution Approach 1:
The resilient pad provides a dynamic mounting solution that allows the sensor to be repositioned and reattached to different locations on the heat sink or chipset. Unlike rigid permanent attachment methods, the resilient nature of the pad enables adjustment and customization of sensor position when chipset layouts are altered, while still maintaining adequate thermal contact for accurate measurement
3Measurement precision
If the thermistor sensor is placed as close as possible to the chipset by tightly attaching it to the heat sink, then temperature measurement accuracy is improved, but the installation process becomes more complex and costly
Solution Approach 1:
The resilient pad serves as a mediator that simplifies the manufacturing and installation process. Instead of requiring complex machining grooves, multiple fasteners, and precise alignment procedures, the pad provides a simple adhesive-backed mounting solution that achieves close sensor-to-chipset placement while being easy to install and manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables accurate chipset temperature measurement while reducing installation costs and time, and allows for easy adjustment of sensor positions, improving flexibility and efficiency in thermal management systems.
Implementation Method 1
when the resilient pad is compressed between the heat sink and the PCB, a spring force of the resilient pad facilitates the measurement by pressing the sensing element against the heat sink
Implementation Method 2
The thermistor sensor includes a first end having a sensing element to measure the temperature
Data Source
AI summary
A thermistor sensor arrangement for measuring chipset temperature is provided. According to various aspects of the present disclosure, a sensor assembly is placed between a heat sink of a chipset and a PCB on which the chipset is mounted. The sensor assembly includes a thermistor sensor, an electrical connector, and a resilient pad. The thermistor sensor includes a first end having a sensing element and a second end having sensor contacts. The electrical connector has a first interface to receive the sensor contacts, a second interface through which the signals are outputted, and a bottom surface to mount to the PCB. The resilient pad has an upper surface to which the sensing element is attached and a lower surface to engage with the PCB such that when the resilient pad is compressed, spring force of the resilient pad facilitates temperature measurement by pressing the sensing element against the heat sink.