Thermistor Space Design for Light Emitting Device Temperature Detection

A resin layer is introduced as an intermediary between the thermistor and the base. This resin layer serves as a buffer that maintains stable bonding over time and temperature changes, preventing the thermistor from detaching while ensuring accurate temperature detection. The resin acts as a mediator that decouples the thermistor from direct mechanical stress and thermal expansion differences with the base.

The resin layer is applied in advance during the manufacturing process, before the thermistor is bonded to the base. This preliminary action creates a pre-prepared bonding interface that inherently resists detachment, eliminating the need for complex post-manufacturing process controls to prevent thermistor lifting. The resin is applied to the base surface beforehand, establishing a stable bonding foundation from the start.

The resin layer serves as a stable intermediary that maintains consistent contact between the thermistor and the base even when thermal expansion or mechanical stress occurs. This prevents the thermistor from lifting and ensures continuous, accurate temperature detection. The resin buffer absorbs dimensional changes and maintains bonding integrity, preventing both detachment and detection value fluctuations.