Thermistor-on-Substrate Layout for Noise-Free Chip Temperature Sensing
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Solution Overview
Problem
Existing semiconductor devices face issues with noise in thermistor output signals due to potential fluctuations and unreliable insulation between the thermistor and semiconductor element, as well as difficulties in performing wire bonding on the thermistor electrodes.
Innovation Solution
A semiconductor device design where a thermistor is mounted on an insulating substrate bonded to the semiconductor chip, ensuring reliable insulation and allowing pattern wiring to lead the thermistor electrodes outside for efficient wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thermistor is bonded to a main electrode of a semiconductor element by soldering, then the thermistor is firmly attached to the semiconductor element, but noise occurs in the output signal of the thermistor due to potential fluctuation of the main electrode when current flows
Solution Approach 1:
The patent introduces an insulating substrate as an intermediary between the semiconductor element and the thermistor. This substrate provides both mechanical support for firm attachment and electrical insulation to prevent noise, thereby resolving the contradiction between strong attachment and signal reliability.
2Reliability
If a thermistor is attached to a main electrode of a semiconductor element using an insulative adhesive agent, then insulation between the thermistor and semiconductor element is provided, but the thickness of the adhesive agent varies making reliability of insulation uncertain and wire bonding difficult
Solution Approach 1:
The patent replaces the insulative adhesive agent with a rigid insulating substrate that provides consistent thickness and reliable insulation. The substrate serves as a permanent structural component rather than a consumable adhesive, ensuring uniform electrical insulation and enabling precise wire bonding operations.
3Reliability
If a thermistor is attached to a main electrode of a semiconductor element using an insulative adhesive agent, then insulation is provided, but it is difficult to perform wire bonding on the electrode of the thermistor
Solution Approach 1:
The patent separates the insulation function from the attachment function by introducing a distinct insulating substrate. This segmentation creates a dedicated bonding surface on the substrate for wire bonding, independent of the adhesive layer, thereby facilitating easier and more reliable wire bonding operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures highly reliable insulation between the thermistor and semiconductor element, facilitates wire bonding on the thermistor electrodes, and simplifies the assembly process while enhancing the measurement accuracy of the semiconductor chip's temperature.
Implementation Method 1
the semiconductor chip and the thermistor are insulated from each other by the insulating substrate
Implementation Method 2
A thickness of the insulating substrate hardly varies, thus highly reliable insulation is ensured between the thermistor and the semiconductor element
Data Source
AI summary
A semiconductor device includes a semiconductor chip and a thermistor mounted on the semiconductor chip. The thermistor is mounted on an insulating substrate bonded to the semiconductor chip, and the semiconductor chip and the thermistor are insulated from each other by the insulating substrate. Formed on the insulating substrate is a pattern wiring leading an electrode of the thermistor outside of the thermistor in a plan view.