Thermo-Optic Phase Modulator Layout With Side Heat Insulation Grooves

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Solution Overview

Problem

Thermo-optic phase modulation modules suffer from large heat loss, limiting their modulation efficiency and the efficiency of optical modulators.

Innovation Solution

A thermo-optic phase modulation module with side heat insulation grooves and heating elements arranged around a waveguide to minimize heat dissipation, concentrating heat on the waveguide for improved modulation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If heat insulation grooves are added to reduce heat loss, then modulation efficiency is improved, but device complexity increases

Engineering Contradiction:

Improvemodulation efficiencyVSAvoidstructure complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The device is segmented by introducing heat insulation grooves that divide the heat transmission path into isolated sections. These grooves partition the substrate into distinct thermal zones, preventing heat diffusion to surrounding areas and concentrating thermal energy where needed for phase modulation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Heat insulation properties are applied locally at specific positions around the waveguide and heating element rather than throughout the entire device. The grooves are strategically placed only where heat loss occurs, providing targeted thermal management without affecting the overall device structure or requiring complete thermal isolation.

Inventive Principle:

Principle #3Local quality

2Power

If heating power is increased to improve modulation efficiency, then phase modulation range is improved, but heat loss increases

Engineering Contradiction:

Improvephase modulation rangeVSAvoidheat loss

Core Design Contradiction:

PowerVSLoss of energy

Solution Approach 1:

The heat that would normally be lost to the substrate and surrounding areas is converted into a beneficial concentrated thermal source. The heat insulation grooves redirect what would be wasted heat energy back toward the waveguide region, transforming thermal loss into useful thermal energy that enhances phase modulation efficiency.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The thermal parameters of the device are changed by introducing regions with different thermal conductivities. The heat insulation grooves create localized areas of low thermal conductivity that alter the overall heat distribution pattern, allowing higher heating power to be applied without proportional increases in heat loss.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If heating element size is increased to improve heating efficiency, then modulation efficiency is improved, but device area increases

Engineering Contradiction:

Improvemodulation efficiencyVSAvoiddevice area

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

Thermal management is applied locally through heat insulation grooves positioned specifically around the heating element and waveguide interface. This localized approach allows the heating element to operate more efficiently within its existing footprint without requiring additional device area, as the grooves prevent lateral heat diffusion.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The heat insulation grooves are asymmetrically distributed around the heating element and waveguide structure, with grooves placed preferentially in directions where heat loss is most significant. This asymmetric configuration optimizes thermal confinement within the existing device boundaries without requiring symmetric expansion of the device area.

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances heating efficiency of the waveguide, resulting in improved modulation efficiency of the thermo-optic phase modulation module and the optical modulator.

Implementation Method 1

a heating element located on the isolation layer and not overlapping with the first waveguide in a direction perpendicular to a bottom surface of the substrate

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

the thermo-optic phase modulation module is provided with a plurality of side heat insulation grooves extending downwardly from a top surface and exposing the substrate, and the plurality of side heat insulation grooves are arranged around the first waveguide and the at least one heating element

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

a first waveguide located on the isolation layer

Methodology Applied

Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS12631909B2Thermo-optic phase modulation module and optical modulator

Publication Date: 2026.05.19 NANJING LYCORE TECH CO LTD

AI summary

A thermo-optic phase modulation module and an optical modulator are provided. The thermo-optic phase modulation module includes: a substrate; an isolation layer located on substrate; a first waveguide located on isolation layer; and at least one heating element located on the isolation layer and not overlapping with the first waveguide in a direction perpendicular to a bottom surface of the substrate. The thermo-optic phase modulation module is provided with a plurality of side heat insulation grooves extending downwardly from a top surface and exposing the substrate, and the plurality of side heat insulation grooves are arranged around the first waveguide and the at least one heating element.