Thermo-optic Waveguide Thermal Recirculation Design
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Solution Overview
Problem
The challenge in integrated optics is to densely pack optical devices while minimizing optical propagation loss and power consumption, as existing thermal devices require substantial power to achieve desired optical property manipulations.
Innovation Solution
A thermo-optical device with a thermal tuning section and a thermal device in thermal communication, where the thermal tuning section traverses a thermal boundary with a non-linear shape and a surface area ratio less than 5, enhancing thermal communication without significant power loss, and a method for fabricating this device using photoresist layers and cladding with high index contrast.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If thermal devices are used to manipulate optical properties in densely packed integrated optical devices, then the desired optical function is achieved, but power consumption increases substantially
Solution Approach 1:
The waveguide is nested within the thermal device structure, with the thermal tuning section forming a serpentine path inside the thermal boundary. This nested configuration maximizes thermal communication between the thermal device and waveguide, enabling efficient optical property manipulation with reduced power consumption.
Solution Approach 2:
The thermal tuning section extends in the vertical dimension by traversing the thermal region multiple times in a serpentine pattern. This multi-dimensional thermal path increases the thermal interaction surface area without significantly increasing the horizontal footprint, thereby improving thermal efficiency while maintaining compact device dimensions.
2Productivity
If optical devices are densely packed on a single integrated optical chip, then device integration is improved, but optical propagation loss increases due to minimum radius of curvature constraints
Solution Approach 1:
The waveguide employs curved paths with optimized radius of curvature to navigate the densely packed integrated optical chip. The curved waveguide sections are designed with sufficient radius to minimize optical propagation loss while enabling compact routing and high device integration density.
3Reliability
If the thermal tuning section traverses the thermal region multiple times with a serpentine shape, then thermal communication is enhanced, but device complexity increases
Solution Approach 1:
The thermal tuning section is segmented into multiple linear segments arranged in a serpentine pattern. Each segment contributes to the overall thermal communication, and the segmented structure allows for modular design and fabrication while achieving enhanced thermal interaction through multiple traversals of the thermal region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient modulation of light signals by altering refractive index and phase difference with reduced power consumption and minimal optical propagation loss, enabling more compact and efficient integrated optical devices.
Implementation Method 1
the thermal device is in thermal communication with the thermal tuning section of the waveguide
Implementation Method 2
heating an optical waveguide can alter the refractive index affecting the phase of the optical signal propagating through the optical waveguide
Data Source
AI summary
Thermo-optical devices providing heater recirculation in an integrated optical device are described. The thermo-optical devices include at least one waveguide having a non-linear path length in thermal communication with a thermal device. Methods of fabrication and use are also disclosed.