Thermo-Release Foil for Semiconductor Wafer Separation
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Solution Overview
Problem
Current methods for separating semiconductor devices from a wafer and transferring them to a carrier are inefficient, often damaging the devices and requiring costly and environmentally harmful processes, especially when dealing with rejects and varying device sizes.
Innovation Solution
A method involving the use of a thermo-release foil with adjustable adhesive force, combined with mechanical or acoustical impulses from gas jets or sound, to gently detach semiconductor devices from the carrier, followed by sorting and alignment using a mechanical separating unit and apparatus designed to minimize device damage and environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional separation methods are used to transfer semiconductor devices from wafer to carrier, then the separation process can be completed, but the devices are damaged and the process is costly and environmentally harmful
Solution Approach 1:
The patent replaces conventional mechanical separation methods with a thermal release mechanism. A release layer is deposited on the carrier, and thermal energy is applied to activate the release mechanism, allowing devices to transfer from wafer to carrier without mechanical contact that causes damage. This substitution eliminates the need for harmful chemical processes and reduces environmental impact while maintaining device integrity.
Solution Approach 2:
The patent changes the physical state or properties of materials during the separation process. Specifically, thermal energy is applied to change the adhesive properties of the release layer, transitioning it from a bonded state to a release state. This parameter change enables gentle device transfer without mechanical stress, preventing damage while avoiding costly and harmful conventional methods.
2Productivity
If conventional separation methods are used, then devices can be separated from the wafer, but the process is slow and sequential
Solution Approach 1:
The patent merges multiple separation operations into a single parallel process. By depositing a release layer across the entire carrier surface and applying thermal energy uniformly, multiple devices are separated and transferred simultaneously rather than sequentially. This consolidation of operations dramatically increases productivity while reducing the total time required for the separation process.
Solution Approach 2:
The release layer is deposited on the carrier in advance, before the actual separation process. This preliminary preparation allows the thermal release mechanism to be activated simultaneously for all devices, enabling parallel processing. The pre-positioned release layer eliminates the need for sequential operations, thereby increasing productivity and reducing process time.
3Adaptability or versatility
If conventional methods are used to handle rejects and varying device sizes, then all devices can be processed, but the process complexity increases and damage risk increases
Solution Approach 1:
The thermal release mechanism serves multiple functions: it handles devices of varying sizes, processes rejects (defective devices), and transfers good devices to the carrier in a single unified process. The release layer's thermal response is size-independent, allowing the same mechanism to handle diverse device types without increasing process complexity. This universal approach simplifies the overall process while maintaining adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables a fast, cost-effective, and environmentally friendly parallel process for separating and transferring semiconductor devices, reducing damage and residue, while allowing for efficient sorting and alignment, thus improving the semiconductor fabrication process.
Implementation Method 1
By way of example, UV-energy, thermal energy, mechanical energy or any other kind of energy that is capable of reducing the adhesive force of the carrier or the adhesive foil may be applied to the carrier or the adhesive foil.
Implementation Method 2
In a next step mechanical or acoustical impulses may be applied to the carrier or the adhesive foil in order to detach the semiconductor devices from the carrier or the adhesive foil.
Implementation Method 3
In a next step mechanical or acoustical impulses may be applied to the carrier or the adhesive foil in order to detach the semiconductor devices from the carrier or the adhesive foil.
Data Source
AI summary
An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.