Non-Contact Thermo-Sensor Layout for Low-Temperature Wafer Heating
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Solution Overview
Problem
In semiconductor manufacturing, accurately measuring the temperature of a workpiece heated by a lamp is challenging due to the difference between temporal and spatial temperatures, and existing noncontact thermo-sensors face reliability issues when measuring temperatures below 300°C, especially with wavelengths of 5 μm or more, as quartz materials block these wavelengths, making it difficult to achieve precise temperature control.
Innovation Solution
A process apparatus with a heating module containing multiple heating lamps and noncontact thermo-sensors, where a blocking plate with a window allows light of 5 μm or more to pass through to the sensor, and a filter blocks shorter wavelengths, enabling accurate temperature measurement and control by receiving light with a wavelength of 5 μm or more, and adjusting heating power in real-time based on measured temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a noncontact thermo-sensor is used to measure the temperature of a workpiece heated by a heating lamp, then the temperature can be measured without direct contact, but the measurement reliability is reduced due to wavelength overlap between the heating lamp and the thermo-sensor
Solution Approach 1:
The patent segments the wavelength spectrum into different bands by introducing a filter that separates the heating lamp wavelength band from the thermo-sensor measurement wavelength band. This allows the thermo-sensor to measure temperature without interference from the heating lamp by only receiving light in a specific wavelength range (e.g., 5 μm or more), thus resolving the wavelength overlap issue while maintaining noncontact measurement capability.
2Ease of manufacture
If quartz material is used in the optical path, then the structure is simple and easy to manufacture, but light with wavelength of 5 μm or more is blocked, preventing accurate temperature measurement below 300°C
Solution Approach 1:
The patent changes the optical parameter (wavelength transmission characteristic) by introducing a filter that transmits light with wavelength of 5 μm or more while blocking shorter wavelengths. This parameter change enables the optical path to transmit the specific wavelength range needed for accurate low-temperature measurement below 300°C, overcoming the limitation of quartz material that blocks these wavelengths.
3Productivity
If the front side of the workpiece is heated by light, then heating efficiency is improved, but the difference between temporal temperature and spatial temperature becomes large, making temperature measurement difficult
Solution Approach 1:
The patent introduces a filter as an intermediary component in the optical path that mediates between the heating lamp and the thermo-sensor. The filter selectively transmits light wavelengths that carry temperature information from the workpiece surface to the thermo-sensor while blocking other wavelengths, enabling accurate temperature measurement of the heated front side despite the temporal-spatial temperature difference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise, real-time temperature measurement and control of workpieces at temperatures below 300°C, improving the reliability of temperature information and enabling efficient heating processes by minimizing noise and ensuring accurate temperature data transmission.
Implementation Method 1
the blocking plate includes at least one window spatially connecting the at least one temperature sensor to the process space
Implementation Method 2
at least one heating lamp disposed in the housing
Implementation Method 3
measuring a temperature of the workpiece by using the at least one temperature sensor
Data Source
AI summary
A process apparatus includes a heating module and a supporter disposed below the heating module. A process space is provided between the heating module and the supporter. The heating module includes a housing, at least one heating lamp disposed in the housing, at least one temperature sensor disposed in the housing, and a blocking plate disposed under the housing. The blocking plate spatially separates the at least one heating lamp from the process space, and the blocking plate includes at least one window spatially connecting the at least one temperature sensor to the process space.