Thermochromic Epoxy Resin for Semiconductor Encapsulation

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Solution Overview

Problem

Existing epoxy resin compositions for encapsulating semiconductor devices lack effective heat resistance and visibility during laser marking, leading to potential damage from excessive laser intensity and poor appearance in colored semiconductor packages.

Innovation Solution

An epoxy resin composition incorporating a thermochromic pigment with a metal oxalate formula that irreversibly changes color at temperatures above 260°C, combined with a colorant and filler, to provide high heat resistance and clear marking visibility without damaging the semiconductor chip.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional epoxy resin composition is used for encapsulation, then basic protection is provided, but heat resistance is insufficient and laser marking visibility is poor

Engineering Contradiction:
Improveheat resistanceVSAvoidlaser marking visibility
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent introduces a thermochromic pigment that undergoes irreversible color change at temperatures above 260°C. During laser marking, the pigment changes color to provide clear visibility of the marked area. This resolves the contradiction by enabling both heat resistance (the pigment stabilizes at high temperatures) and marking visibility (the color change provides visual feedback during marking).

Inventive Principle:
Principle #32Color changes

Solution Approach 2:

The patent creates a composite epoxy resin composition containing multiple components: base resin, curing agent, filler, colorant, and thermochromic pigment. This composite structure combines the heat resistance of the epoxy base with the visual indication capability of the thermochromic pigment, simultaneously achieving both reliability and ease of manufacture.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If high laser intensity is used for marking, then marking visibility improves, but semiconductor chip damage occurs

Engineering Contradiction:
Improvemarking visibilityVSAvoidchip damage
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The thermochromic pigment provides clear visual indication of the marked area through color change at temperatures above 260°C. This allows marking to be performed at lower laser intensities while still achieving adequate visibility, thereby preventing chip damage while maintaining marking quality.

Inventive Principle:
Principle #32Color changes

Solution Approach 2:

The thermochromic pigment provides real-time visual feedback during the laser marking process. The color change indicates when the marking temperature is reached, allowing precise control of the marking process and preventing excessive laser intensity that could damage the chip.

Inventive Principle:
Principle #23Feedback

3Shape

If colorant is added for appearance, then aesthetic value improves, but heat-induced discoloration occurs

Engineering Contradiction:
ImproveappearanceVSAvoidcolor stability
Core Design Contradiction:
ShapeVSStability of the object's composition

Solution Approach 1:

The thermochromic pigment is specifically selected to undergo color change only at temperatures above 260°C, which is higher than the processing temperatures encountered during normal manufacturing and use. This allows the colorant to provide aesthetic value while remaining stable against heat-induced discoloration at operational temperatures.

Inventive Principle:
Principle #32Color changes

Solution Approach 2:

The patent carefully selects thermochromic pigments with specific color change temperatures (above 260°C) that are higher than the processing and operational temperatures. This parameter selection ensures the colorant provides aesthetic value while maintaining color stability under normal heat exposure conditions.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition ensures excellent heat resistance, prevents discoloration, and facilitates clear marking with low laser intensity, enhancing the appearance and protection of semiconductor packages while maintaining electrical insulation and mechanical strength.

Implementation Method 1

a thermochromic pigment, wherein a color of the thermochromic pigment is irreversibly changed when a temperature thereof exceeds a predetermined temperature

Methodology Applied
Scientific EffectThermochromism: Thermochromism

Implementation Method 2

maintaining electrical insulation and mechanical strength

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 3

the composition including a base resin; a filler; a colorant; and a thermochromic pigment

Methodology Applied
Scientific EffectComposite materials: Composite Materials

Data Source

PatentUS9735076B2Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by the same
Publication Date: 2017.08.15 SAMSUNG SDI CO LTD
  • US9735076B2 patent drawing
  • US9735076B2 patent drawing
  • US9735076B2 patent drawing

AI summary

An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated by the epoxy resin composition, the composition including a base resin; a filler; a colorant; and a thermochromic pigment, wherein a color of the thermochromic pigment is irreversibly changed when a temperature thereof exceeds a predetermined temperature.