Thermochromic Epoxy Resin for Semiconductor Encapsulation
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Solution Overview
Problem
Existing epoxy resin compositions for encapsulating semiconductor devices lack effective heat resistance and visibility during laser marking, leading to potential damage from excessive laser intensity and poor appearance in colored semiconductor packages.
Innovation Solution
An epoxy resin composition incorporating a thermochromic pigment with a metal oxalate formula that irreversibly changes color at temperatures above 260°C, combined with a colorant and filler, to provide high heat resistance and clear marking visibility without damaging the semiconductor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional epoxy resin composition is used for encapsulation, then basic protection is provided, but heat resistance is insufficient and laser marking visibility is poor
Solution Approach 1:
The patent introduces a thermochromic pigment that undergoes irreversible color change at temperatures above 260°C. During laser marking, the pigment changes color to provide clear visibility of the marked area. This resolves the contradiction by enabling both heat resistance (the pigment stabilizes at high temperatures) and marking visibility (the color change provides visual feedback during marking).
Solution Approach 2:
The patent creates a composite epoxy resin composition containing multiple components: base resin, curing agent, filler, colorant, and thermochromic pigment. This composite structure combines the heat resistance of the epoxy base with the visual indication capability of the thermochromic pigment, simultaneously achieving both reliability and ease of manufacture.
2Ease of manufacture
If high laser intensity is used for marking, then marking visibility improves, but semiconductor chip damage occurs
Solution Approach 1:
The thermochromic pigment provides clear visual indication of the marked area through color change at temperatures above 260°C. This allows marking to be performed at lower laser intensities while still achieving adequate visibility, thereby preventing chip damage while maintaining marking quality.
Solution Approach 2:
The thermochromic pigment provides real-time visual feedback during the laser marking process. The color change indicates when the marking temperature is reached, allowing precise control of the marking process and preventing excessive laser intensity that could damage the chip.
3Shape
If colorant is added for appearance, then aesthetic value improves, but heat-induced discoloration occurs
Solution Approach 1:
The thermochromic pigment is specifically selected to undergo color change only at temperatures above 260°C, which is higher than the processing temperatures encountered during normal manufacturing and use. This allows the colorant to provide aesthetic value while remaining stable against heat-induced discoloration at operational temperatures.
Solution Approach 2:
The patent carefully selects thermochromic pigments with specific color change temperatures (above 260°C) that are higher than the processing and operational temperatures. This parameter selection ensures the colorant provides aesthetic value while maintaining color stability under normal heat exposure conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition ensures excellent heat resistance, prevents discoloration, and facilitates clear marking with low laser intensity, enhancing the appearance and protection of semiconductor packages while maintaining electrical insulation and mechanical strength.
Implementation Method 1
a thermochromic pigment, wherein a color of the thermochromic pigment is irreversibly changed when a temperature thereof exceeds a predetermined temperature
Implementation Method 2
maintaining electrical insulation and mechanical strength
Implementation Method 3
the composition including a base resin; a filler; a colorant; and a thermochromic pigment
Data Source
AI summary
An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated by the epoxy resin composition, the composition including a base resin; a filler; a colorant; and a thermochromic pigment, wherein a color of the thermochromic pigment is irreversibly changed when a temperature thereof exceeds a predetermined temperature.


