Thermal Interface Paste With Thermochromic Heat-Cure Indication
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor devices face heat-related failures during manufacturing due to inadequate heat management, which existing technologies struggle to address effectively.
Innovation Solution
A semiconductor package design incorporating a thermosetting resin layer with an irreversible thermochromic pigment, a metal plate, and a molding member, along with a thermal interface material (TIM) paste containing a matrix polymer, cross-linking agent, and uniformly dispersed irreversible thermochromic pigment, to enhance heat dissipation and visually indicate appropriate thermal energy application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface material is used to dissipate heat from semiconductor devices, then heat management is improved, but it becomes difficult to monitor whether appropriate thermal energy has been applied during manufacturing
Solution Approach 1:
The patent incorporates an irreversible thermochromic pigment into the thermal interface material that changes color when exposed to thermal energy within a specific range (60°C to 400°C). This color change provides visual feedback indicating that appropriate thermal energy has been applied during manufacturing processes, resolving the monitoring difficulty while maintaining heat dissipation functionality.
2Ease of operation
If traditional thermal interface materials are used, then heat dissipation is provided, but visual inspection of thermal energy application is not possible
Solution Approach 1:
The irreversible thermochromic pigment serves as a visual feedback mechanism that indicates whether thermal energy within the appropriate range has been applied. The color change provides immediate visual confirmation of proper thermal processing, enabling easy inspection while ensuring reliable heat management through verified thermal energy application.
3Difficulty of detecting and measuring
If irreversible thermochromic pigment is added to thermal interface material, then visual indication of thermal energy application is enabled, but material composition complexity increases
Solution Approach 1:
The patent creates a composite thermal interface material by integrating an irreversible thermochromic pigment into the existing thermal interface material matrix. This composite structure combines the heat dissipation properties of the base material with the thermal detection capability of the pigment, enabling visual detection while managing composition complexity through a unified material system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat in semiconductor packages, allowing for quick and easy visual inspection of thermal energy application, ensuring proper heat dissipation and preventing device failures by using the color change temperature range of the thermochromic pigment to indicate thermal energy distribution.
Implementation Method 1
an irreversible thermochromic pigment uniformly dispersed in the matrix polymer, a color change temperature of the irreversible thermochromic pigment is about 60° C. to about 400° C.
Implementation Method 2
a thermosetting resin layer between the first semiconductor device and the heat dissipation unit and between the second semiconductor device and the heat dissipation unit
Implementation Method 3
a cross-linking agent, wherein the matrix polymer includes thermosetting resin
Data Source
AI summary
A semiconductor package includes at least one semiconductor device mounted on a first substrate, a thermosetting resin layer on the at least one semiconductor device, the thermosetting resin layer including an irreversible thermochromic pigment, a metal plate on the thermosetting resin layer, and a molding member surrounding the at least one semiconductor device at least in a lateral direction and being in contact with the thermosetting resin layer.