Thermocompression Bonding Tape Adhesion via Double-Sided Adhesive
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Solution Overview
Problem
The use of thermocompression bonding conductive tape in liquid crystal display devices is hindered by its lack of adhesion at room temperature, requiring manual and time-consuming processes, which increases production costs and reduces efficiency in mass production.
Innovation Solution
A liquid crystal display device configuration that uses a thermocompression bonding conductive tape connected via a double-sided adhesive tape, allowing for temporary fixation and adhesion at elevated temperatures, and optionally using a polyimide-based one-sided adhesive tape for additional support, to facilitate efficient electrical connections between the transparent conductive film and ground pad.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermocompression bonding conductive tape is used to connect transparent conductive film and ground pad, then adhesion and electrical connection are achieved, but manual handling is required due to lack of adhesion at room temperature
Solution Approach 1:
A double-sided adhesive tape is introduced as an intermediary between the thermocompression bonding conductive tape and the substrates. This adhesive tape provides initial adhesion at room temperature, allowing automated placement of the conductive tape without manual handling, while the thermocompression bonding process subsequently activates the conductive tape's adhesion for reliable electrical connection.
2Reliability
If thermocompression bonding conductive tape is used, then electrical connection is achieved, but production time increases due to manual processes
Solution Approach 1:
The double-sided adhesive tape enables the thermocompression bonding conductive tape to self-adhere to the substrates during automated assembly processes. This eliminates the need for manual positioning and handling, allowing the conductive tape to automatically secure itself in place before thermocompression bonding activates its electrical connection function.
3Manufacturing precision
If manual handling is used for thermocompression bonding conductive tape, then proper placement is achieved, but production costs increase
Solution Approach 1:
The double-sided adhesive tape serves as a mediator that enables automated placement systems to accurately position the thermocompression bonding conductive tape without manual intervention. The adhesive properties of the double-sided tape allow robotic pick-and-place equipment to securely hold and precisely position the conductive tape, achieving high placement accuracy while eliminating costly manual labor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the manufacture of liquid crystal display devices at a lower cost by simplifying the connection process, reducing manual labor, and improving production efficiency while maintaining the necessary adhesion and heat resistance for reliable connections.
Implementation Method 1
a double-sided adhesive tape is arranged between the thermocompression bonding conductive tape and an upper surface of the color filter substrate and between the thermocompression bonding conductive tape and the TFT substrate
Implementation Method 2
the transparent conductive film of the color filter substrate and the ground pad formed on the TFT substrate are electrically connected with each other via a thermocompression bonding conductive tape
Data Source
AI summary
A liquid crystal display device which can be manufactured at a low cost is provided. The liquid crystal display device includes a TFT substrate, a CF substrate of a size smaller than a size of the TFT substrate, and a liquid crystal layer sandwiched between the TFT substrate and the CF substrate. A ground pad is formed on a portion of the TFT substrate where the CF substrate does not overlap with the TFT substrate. A transparent conductive film is formed on an upper surface of the CF substrate. The transparent conductive film of the CF substrate and the ground pad formed on the TFT substrate are electrically connected with each other via a thermocompression bonding conductive tape. A double-sided adhesive tape is arranged between the thermocompression bonding conductive tape and an upper surface of the CF substrate and between the thermocompression bonding conductive tape and the TFT substrate.