Thermocompression Sheet Wafer Support Without Frame Maintenance
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Solution Overview
Problem
Existing methods for processing plate-shaped workpieces, such as semiconductor wafers, are low in productivity due to the need for time-consuming maintenance processes on supporting frames after processing.
Innovation Solution
A method involving the use of a thermocompression sheet larger than the workpiece to support and bond with it, eliminating the need for frames by supporting the workpiece on the thermocompression sheet, and utilizing the sheet to divide it into chips, followed by picking up the chips without requiring frame maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a frame is used to support the wafer, then the wafer can be stably supported during processing, but the frame requires time-consuming maintenance processes that reduce productivity
Solution Approach 1:
The patent replaces the reusable frame with a disposable adhesive tape that is discarded after a single use. This eliminates the time-consuming maintenance process while providing sufficient support stability during processing. The adhesive tape is applied to the wafer surface, processed, and then the entire tape-wafer assembly is discarded, ensuring no contamination from repeated use.
Solution Approach 2:
The patent extracts the support function from the complex frame structure and implements it through a simple adhesive tape layer. By removing the frame component entirely, the maintenance burden is eliminated while the essential support function is preserved through the adhesive tape's bonding capability.
2Ease of operation
If adhesive tape is used on a frame, then the wafer can be supported, but the frame maintenance process becomes tedious and time-consuming
Solution Approach 1:
The adhesive tape is used as a single-use component that is discarded after processing. This eliminates the need to clean and maintain the frame, as the entire support system (tape + wafer) is disposed of after one use, saving significant maintenance time.
Solution Approach 2:
Instead of recovering and cleaning the frame for reuse, the patent adopts a discarding approach where the adhesive tape and its supporting structure are discarded after a single use. This simplifies the process by eliminating the recovery and cleaning steps entirely.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances productivity by eliminating the need for frame maintenance, allowing for efficient and cost-effective processing of plate-shaped workpieces.
Implementation Method 1
heating the thermocompression sheet to pressure-bond the thermocompression sheet to the plate-shaped workpiece
Data Source
AI summary
A method of processing a plate-shaped workpiece includes a workpiece supporting step of placing the plate-shaped workpiece on a thermocompression sheet whose area is larger than that of the plate-shaped workpiece, heating the thermocompression sheet to pressure-bond the thermocompression sheet to the plate-shaped workpiece, and supporting the plate-shaped workpiece on only the thermocompression sheet, a processing step of processing the plate-shaped workpiece to divide the plate-shaped workpiece into a plurality of chips, and a pick-up step of picking up the chips from the thermocompression sheet.