Thermocompression Stage Slope Surfaces for Uneven Terminal Alignment
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Solution Overview
Problem
Conventional thermocompression apparatuses fail to evenly bond multiple scheduled portions simultaneously due to unstable dimensional accuracy, leading to connection failures in electronic devices with uneven terminal heights.
Innovation Solution
A thermocompression apparatus with a stage featuring a maximum convex and slope surfaces allows the component to tilt and rotate, enabling the heater chip to self-align and press multiple scheduled portions effectively, ensuring uniform bonding despite manufacturing errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a heater chip pushes multiple scheduled portions of thermocompression simultaneously in a conventional thermocompression apparatus, then productivity is improved, but manufacturing precision deteriorates due to uneven compression states
Solution Approach 1:
The installation surface is designed with slope surfaces instead of a completely flat surface, creating a dynamic adjustment mechanism. When the heater chip presses down, components with higher terminal portions naturally tilt toward the slope surface, allowing the heater chip to maintain contact with multiple scheduled portions despite height variations, thus achieving both simultaneous thermocompression and uniform compression force
Solution Approach 2:
The system uses the components' own height variations to drive the tilting motion on the slope surface. The maximum convex portion acts as a reference point, and components automatically adjust their orientation based on their terminal portion heights, eliminating the need for external positioning mechanisms or complex control systems
2Adaptability or versatility
If components with manufacturing errors are processed using conventional thermocompression apparatus, then adaptability is improved, but reliability deteriorates due to connection failures
Solution Approach 1:
The slope surface creates a dynamic compensation mechanism where components with varying terminal heights automatically tilt during the thermocompression process. This dynamic adjustment ensures that the heater chip maintains proper contact with all scheduled portions, preventing connection failures while accommodating manufacturing variations
Solution Approach 2:
The system changes the geometric parameters of the installation surface by introducing slope surfaces with specific angles. This parameter change allows the system to accommodate a range of terminal portion heights while maintaining consistent compression force, thereby improving both adaptability and reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution prevents thermocompression failures by ensuring all scheduled portions are evenly heated and pressed, improving the alignment and bonding efficiency of the apparatus, even with components having manufacturing errors.
Implementation Method 1
a heater chip disposed to be freely movable to and from the scheduled portion of thermocompression of the component opposite to the installation surface of the stage and configured to heat and press the scheduled portion of thermocompression
Implementation Method 2
the component tilts from the maximum convex of the installation surface toward one of the slope surfaces, whereby the other scheduled portion of thermocompression is moved closer to the heater chip
Data Source
AI summary
A thermocompression apparatus includes a stage and a heater chip. The stage includes an installation surface on which a component having a scheduled portion of thermocompression is placed. The heater chip is disposed to be freely movable to and from the scheduled portion of thermocompression of the component opposite to the installation surface of the stage and is configured to heat and press the scheduled portion of thermocompression. The installation surface includes a maximum convex and a pair of slope surfaces. The maximum convex is configured to contact with a bottom surface of the component. The pair of slope surfaces has heights decreasing respectively from the maximum convex toward both sides of the installation surface in a width direction of the component.