Thermocouple Fixing Element for Substrate Temperature Measurement

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Temperature measurement errors occur in substrates that radiate in the infrared spectrum due to large temperature differences between the substrate and external environment, particularly in traveling wave tubes on satellites, where thermocouple sensors experience significant errors from conductive leakage.

Innovation Solution

A thermocouple device with a thermally conductive fixing element and elastic tab that maintains electric wires in thermal contact with the substrate, minimizing conductive leakage and allowing accurate temperature measurement across varying radiative environments.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a thermocouple sensor is fixed with glue on a metal plate to measure substrate temperature, then the measurement can be performed, but significant measurement errors occur (typically 45°C) due to conductive leakage in the thermocouple wires

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidconductive leakage
Core Design Contradiction:
Measurement precisionVSObject-generated harmful factors

Solution Approach 1:

A thermally conductive element is introduced as an intermediary between the thermocouple junction and the substrate. This element conducts heat from the substrate to the junction while electrically insulating the junction from the substrate, thereby eliminating conductive leakage errors in the thermocouple wires while maintaining accurate temperature measurement.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces the traditional mechanical fixation method (glue on metal plate) with a specialized fixing element that uses a thermally conductive element to achieve both mechanical attachment and thermal coupling, while electrically isolating the thermocouple junction to prevent conductive leakage.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If the thermocouple junction is firmly fixed to the substrate to improve measurement accuracy, then measurement precision improves, but the device becomes difficult to remove without damaging the substrate

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidease of removal
Core Design Contradiction:
Measurement precisionVSEase of repair

Solution Approach 1:

The fixing element incorporates an elastic tab that provides dynamic, reversible attachment. The elastic tab can be deformed during installation to secure the junction firmly against the substrate for accurate measurement, and then easily deformed again to release and remove the device without damaging the substrate, thus achieving both firm fixation and ease of removal.

Inventive Principle:
Principle #15Dynamics

3Measurement precision

If a complex fixation structure is used to maintain thermal contact, then measurement accuracy improves, but the device complexity increases

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidfixing element structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent merges multiple functions into a single integrating fixing element: the thermally conductive element provides both thermal coupling and electrical insulation, while the elastic tab provides mechanical attachment and release functionality. This consolidation eliminates the need for separate components (glue, metal plate, additional insulation), thereby reducing overall device complexity while maintaining measurement accuracy.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables precise temperature measurement with errors less than 3°C, maintaining mechanical integrity and allowing for easy removal without damaging the substrate, suitable for ground tests and space deployment.

Implementation Method 1

a thermally conductive element able to carry a portion of electric wires adjacent to the said junction; said thermally conductive element being capable of bringing said portion of electric wires into thermal contact with said substrate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

said elastic tab being capable of exerting pressure on said junction

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 3

measuring the temperature of a substrate which radiates in the infrared spectrum towards an external radiative environment

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentEP2416137B1Device for measuring the temperature of a substrate
Publication Date: 2017.03.15 AIRBUS DEFENCE & SPACE SAS
  • EP2416137B1 patent drawing
  • EP2416137B1 patent drawing
  • EP2416137B1 patent drawing

AI summary

The device has a fixing element (8) comprising a thermally conductive element for bearing a portion of electric wires (10) of a thermocouple (4) adjacent to a junction (12) between the wires. The conductive element ensures thermal contact between the portion of wires and a substrate (6). The fixing element has a thermally conductive support (14) for bearing the junction. The conductive element has a flexible lug (16) fixed to the support and exerting pressure on the junction. A protective element e.g. adhesive strip (28), fixes the portion of the wires to the conductive element.