Thermocouple Heat Spreader Layout for Lidless TTV Heat Flux Replication

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Solution Overview

Problem

Existing datacenter cooling systems struggle to accurately replicate the non-uniform heat flux and thermal characteristics of lidless computing devices, such as GPUs and CPUs, leading to inadequate testing of liquid cooling systems.

Innovation Solution

A thermocouple arrangement within a heat spreader of a thermal test vehicle (TTV) is used to provide accurate heat flux feedback, featuring at least three thermocouples positioned at specific angles and orientations to replicate the thermal characteristics of lidless computing devices, ensuring precise testing of datacenter cooling systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional cooling system testing is used, then testing simplicity is maintained, but thermal characteristic replication accuracy deteriorates

Engineering Contradiction:
Improvethermal characteristic replication accuracyVSAvoidtesting system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent creates a thermal test vehicle that replicates the thermal characteristics of lidless computing devices. The heat spreader with embedded heating elements and thermocouples serves as a simplified copy that mimics the heat generation patterns of actual GPUs or CPUs without requiring the full complex device, enabling accurate thermal testing while reducing device complexity

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The heat spreader acts as an intermediary between the cooling system and the test environment. It receives heat from heating elements, distributes it uniformly, and provides thermal feedback through embedded thermocouples, mediating the thermal interaction to achieve accurate replication of computing device thermal characteristics

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If uniform heat distribution is applied, then thermal field uniformity is improved, but heat flux feedback accuracy deteriorates

Engineering Contradiction:
Improveheat flux feedback accuracyVSAvoidthermal field uniformity
Core Design Contradiction:
Measurement precisionVSStability of the object's composition

Solution Approach 1:

The heat spreader incorporates multiple independently controllable heating elements at different locations, allowing non-uniform heat flux to be applied locally to simulate realistic computing device thermal patterns. Simultaneously, thermocouples are positioned at specific locations to measure local temperature gradients, achieving both realistic heat distribution and accurate feedback

Inventive Principle:
Principle #3Local quality

3Measurement precision

If multiple thermocouples are positioned at various orientations, then thermal measurement accuracy is improved, but device complexity increases

Engineering Contradiction:
Improvethermal measurement accuracyVSAvoidthermocouple arrangement complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The thermal measurement system is segmented into multiple discrete thermocouples positioned at specific orientations (0°, 45°, 90°, 135°) within the heat spreader. Each thermocouple measures temperature at a specific location and angle, and the combined data provides comprehensive thermal characterization. This segmentation enables accurate 3D thermal mapping while keeping each individual sensor simple

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The thermocouple arrangement allows for near-perfect replication of heat generation patterns in lidless computing devices, enabling effective testing and validation of datacenter cooling systems, ensuring they can handle varying heat loads and thermal distributions.

Implementation Method 1

A thermocouple arrangement within a heat spreader of a thermal test vehicle (TTV) is used to provide accurate heat flux feedback

Methodology Applied
Scientific EffectThermocouple: Thermocouple

Implementation Method 2

heat spreader of a thermal test vehicle (TTV) is used to provide accurate heat flux feedback

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12563704B1Thermocouple arrangement in thermal test vehicles to replicate lidless computing devices
Publication Date: 2026.02.24 NVIDIA CORP
  • US12563704B1 patent drawing
  • US12563704B1 patent drawing
  • US12563704B1 patent drawing

AI summary

Systems and methods for testing in a datacenter are disclosed. In at least one embodiment, a thermocouple arrangement within a heat spreader of a thermal test vehicle (TTV) is provided to represent a lidless computing device to be commissioned based in part on heat flux feedback received from a thermocouple arrangement that includes at least two thermocouples at angles from different edges of a heat spreader toward a center of a heat spreader and includes a third thermocouple is perpendicular to at least one of different edges of a heat spreader.