Thermocouple Sensor Assembly Solder Erosion Protection

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Solution Overview

Problem

Temperature measuring devices used with thermal tools, such as soldering devices, face accuracy degradation due to solder erosion of thermocouple conductors, leading to errors in temperature measurement over time and multiple uses.

Innovation Solution

A thermocouple temperature sensor assembly with a contact disk and covering member design that minimizes solder attachment and corrosion, featuring a high solder wettability upper surface and low wettability peripheral rim, along with a non-conductive covering member to protect the signal wires and thermocouple from solder, ensuring precise temperature measurement over extended periods.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a thermocouple sensor assembly is used to measure temperature of soldering devices, then temperature measurement is enabled, but solder erosion of conductors degrades measurement accuracy over time

Engineering Contradiction:

Improvetemperature measurement accuracyVSAvoidsensor durability

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

A non-conductive covering member is introduced as an intermediary between the solder and the thermocouple conductors. This covering member protects the conductors from direct contact with solder, preventing erosion and degradation while allowing the sensor to maintain measurement accuracy over extended periods

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The covering member is designed as a thin, flexible protective layer that conforms to the shape of the thermocouple assembly. This thin film provides adequate protection against solder erosion while maintaining the compact structure and thermal response characteristics of the original sensor

Inventive Principle:

Principle #30Flexible shells and thin films

2Strength

If solder attaches to the thermocouple conductors during temperature measurement, then heat transfer to the thermocouple is improved, but conductor corrosion and breakage occur

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidsolder corrosion

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The covering member provides localized protection specifically at the conductor surfaces exposed to solder, while allowing controlled thermal contact where needed. The non-conductive material is strategically positioned to protect against corrosion while maintaining necessary heat transfer paths for accurate temperature measurement

Inventive Principle:

Principle #3Local quality

3Productivity

If the thermocouple sensor is used multiple times for temperature measurement, then productivity is improved, but measurement accuracy degrades due to conductor erosion

Engineering Contradiction:

Improvemeasurement frequencyVSAvoidtemperature accuracy

Core Design Contradiction:

ProductivityVSMeasurement precision

Solution Approach 1:

The covering member is pre-installed on the thermocouple conductors before use, providing advance protection against solder erosion. This preventive measure ensures that the conductors remain intact and electrically stable throughout multiple measurement cycles, maintaining measurement accuracy without requiring frequent sensor replacement

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents solder from attaching to the signal wires and thermocouple, maintaining measurement accuracy and extending the lifespan of the sensor by reducing corrosion and conductor breakage, allowing for precise temperature readings even after multiple uses.

Implementation Method 1

The tip of a soldering device or soldering tool may be placed on the metal tube and the temperature is measured based on a voltage potential difference of the thermocouple at the contact point

Methodology Applied

Scientific EffectThermocouple effect: Seebeck Effect

Implementation Method 2

The heat of the tip transfers to the thermocouple at the contact point through the solder, and not through air

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11313733B2Sensor and sensor assemblies for a thermometer

Publication Date: 2022.04.26 HAKKO CO LTD

AI summary

The invention is directed to embodiments of a temperature sensor for use with a temperature measuring device, for example a digital thermometer. The temperature sensor includes at least two and preferably three wires joined at a thermocouple. The temperature sensor is designed to be mounted on terminals of the digital thermometer sensor to allow precise temperature measurements for a thermal device, for example a soldering tool or de-soldering tool.