Thermocurable Electroconductive Adhesive Viscosity and Stability
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Solution Overview
Problem
Conventional thermocurable electroconductive adhesives require a large amount of conductive particles to achieve conductivity, leading to increased initial viscosity and preservation stability issues, especially when stored in non-air permeable containers, due to anaerobic curability and metal ion effects.
Innovation Solution
A thermocurable electroconductive adhesive composition comprising an oligomer with (meth)acryl groups, a monomer with one methacryl group, an organic peroxide, and surface-treated electroconductive particles, which allows for improved conductivity and preservation stability with a smaller amount of conductive particles, specifically using a ratio of components that balances curability and viscosity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large amount of electroconductive particles is added to improve conductivity, then conductivity is improved, but initial viscosity increases and preservation stability deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive system by introducing a specific curing agent ratio (component A/component B at 20:80 to 80:20) and using surface-treated electroconductive particles, which allows achieving good conductivity with only 30-80 mass% electroconductive particles, thereby reducing viscosity while maintaining reliability
Solution Approach 2:
The patent creates a composite adhesive system combining organic peroxide, oligomer with (meth)acryl groups, monomer with one methacryl group, and surface-treated electroconductive particles, where the synergistic interaction of components enables reduced particle loading while maintaining both conductivity and stability
2Reliability
If a large amount of electroconductive particles is added, then conductivity is improved, but the adhesive is easily gelled and preservation stability deteriorates
Solution Approach 1:
The patent modifies the chemical parameters by using surface-treated electroconductive particles and controlling the curing agent composition ratio, which suppresses premature gelation and metal ion-catalyzed curing during storage, thereby improving preservation stability while maintaining conductivity
Solution Approach 2:
The surface treatment on electroconductive particles acts as an intermediary layer that prevents direct interaction between metal ions and peroxide, suppressing catalytic curing during storage while allowing conductivity to be achieved with reduced particle amounts
3Ease of operation
If the adhesive is stored in a non-air permeable container, then storage convenience is improved, but anaerobic curability is expressed and the adhesive gels earlier
Solution Approach 1:
The patent changes the curing mechanism parameters by using a specific organic peroxide and controlling the curing agent ratio, which suppresses anaerobic curability during storage in non-air permeable containers, thereby extending storage life while maintaining ease of storage
Solution Approach 2:
The patent creates an inert chemical environment by using surface-treated electroconductive particles that prevent metal ion-catalyzed peroxide decomposition, effectively creating a stable storage condition similar to an inert atmosphere even in non-air permeable containers, thereby extending storage life
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive achieves isotropic conductivity and preservation stability even with a small amount of electroconductive particles, maintaining stability and curability in airtight containers, suitable for electronic component assembly and long-term use.
Implementation Method 1
an organic peroxide having a structure of the following General Formula 1
Implementation Method 2
thermocurability is imparted by changing the kind of curing agent
Implementation Method 3
electroconductive particles which are surface-treated with a stearic acid
Implementation Method 4
surface-treated with a stearic acid
Data Source
AI summary
Conventionally, there was a need to add a large amount of electroconductive particles for improving conductivity, but when the electroconductive particles were added too much, initial viscosity was increased, and at the same time, it was difficult to stabilize preservation stability. However, conductivity can be improved without adding a large amount of the electroconductive particles by selecting a monomer, and at the same time, preservation stability can be stabilized by using certain electroconductive particles. A thermocurable electroconductive adhesive including components (A) to (D): component (A): an oligomer having a (meth)acryl group; component (B): a monomer having one methacryl group in a molecule; component (C): an organic peroxide having a specific structure; and component (D): electroconductive particles which are surface-treated with a stearic acid.