Thermode Device With Vertical Heating Plates for Semiconductor Contact
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Solution Overview
Problem
Conventional thermode devices are inefficient and costly due to their complex design, which results in large external dimensions, making it difficult to arrange multiple devices in parallel with minimal distance, and pose a risk of damage to miniaturized semiconductor components during the mounting process due to uneven heating and pressure application.
Innovation Solution
A thermode device with multiple vertically oriented heating plates and extendable cylindrical pins that allow for simultaneous pressure application and uniform heating of semiconductor components, with adjustable spring force or air cushion for precise pressure compensation, enabling reliable connection of closely spaced components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple individual thermode devices are arranged in parallel to process multiple semiconductor components, then the processing capacity increases, but the external dimensions of the device become too large and the distance between components cannot be reduced below a certain minimum
Solution Approach 1:
The patent combines multiple heating elements and pressure application mechanisms into a single integrated thermode device. The basic body contains multiple heating plates with heating elements that can be individually controlled, allowing multiple semiconductor components to be processed simultaneously within one compact device structure, eliminating the need for multiple separate thermode devices
Solution Approach 2:
The device divides the heating and pressure application functions into separate controllable units within the basic body. Each heating plate with its heating element and associated spring element can be independently controlled, allowing individual adjustment of pressure and temperature for each semiconductor component position while maintaining a compact overall structure
2Length of stationary object
If a common plate with multiple thermodes is used to reduce device size, then the external dimensions are reduced, but individual pressure adjustment for each thermode is lost and uneven pressure application occurs
Solution Approach 1:
The basic body is segmented into multiple independent heating plates, each with its own heating element and spring element. This segmentation allows each thermode position to be independently controlled for pressure and temperature adjustment while maintaining a compact integrated device structure
Solution Approach 2:
The spring elements provide dynamic, adjustable pressure compensation for each heating plate. The spring force can be individually adjusted to compensate for height differences and ensure uniform pressure distribution across all semiconductor components, enabling both compact size and individual pressure control
3Device complexity
If a common plate with multiple thermodes is used, then device complexity is reduced, but uniform heating of individual adhesives and even pressure application cannot be ensured
Solution Approach 1:
The heating system is divided into multiple independent heating plates with separate heating elements, each capable of independent temperature control. This segmentation ensures uniform heat distribution to each adhesive layer while maintaining a relatively simple overall device structure
Solution Approach 2:
Each heating plate is designed with localized heating capability through individual heating elements and temperature sensors. This allows precise temperature control at each thermode position, ensuring uniform heating of individual adhesives while keeping the device structure simple and integrated
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables uniform heating and pressure application across multiple semiconductor components, reducing the risk of damage and allowing for higher throughput in microelectronic assembly processes, even at distances as low as 4 mm between components.
Implementation Method 1
At least one heating wire is arranged inside each heating plate... in order to heat the heating plate by means of electrical energy
Implementation Method 2
uniform heating of individual heating elements which in each case protrude from these heating plates... ensure uniform heating of individual heating elements
Implementation Method 3
each spring element can be adjusted individually by means of an adjusting element, so that individual spring forces can be set
Data Source
AI summary
A thermode device for connecting and/or electrically contacting a plurality of first semiconductor components to at least one support element and/or to a plurality of second semiconductor components by heating an adhesive under the application of pressure. An example thermode device includes a basic body and a heating element which can be extended out of the basic body and which, under the application of pressure, acts on at least one of the first semiconductor components, wherein the basic body has on its underside a plurality of heating plates which are oriented vertically and are arranged next to one another. Each heating plate has on its end and underside a plurality of the extendable heating elements, to the underside of each of which there is assigned a first semiconductor component.