Thermoelectric Module Anchor Layer for Low-Resistance Bonding
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Solution Overview
Problem
The bonding process between thermoelectric elements and electrodes can lead to diffusion of bonding layer components into the thermoelectric element or electrode corrosion, resulting in decreased performance due to reduced bonding strength and increased electrical or thermal resistance.
Innovation Solution
A thermoelectric module design that incorporates an anchor layer between the electrode and thermoelectric element, along with a stress relieving layer and eutectic layer, to enhance bonding strength and prevent component diffusion, eliminating the need for a traditional bonding layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bonding layer is used to bond the thermoelectric element and electrode, then bonding strength is achieved, but component diffusion into the thermoelectric element or electrode corrosion occurs, degrading performance
Solution Approach 1:
An anchor layer is introduced as an intermediary between the electrode and thermoelectric element. This anchor layer serves as a mediator that prevents direct contact and harmful interactions between the bonding layer components and the thermoelectric element, while still enabling effective bonding. The anchor layer acts as a barrier that stops component diffusion and electrode corrosion, thereby maintaining bonding strength without performance degradation.
Solution Approach 2:
The bonding interface is segmented into multiple distinct layers: the original bonding layer, the newly added anchor layer, and the thermoelectric element. This segmentation separates the bonding function from the protective function, allowing the bonding layer to provide adhesion while the anchor layer provides protection against component diffusion and corrosion, thus resolving the contradiction between achieving bonding strength and preventing performance degradation.
2Ease of manufacture
If solder or brazing material is used for bonding, then bonding is achieved at specific temperature ranges, but component diffusion and electrode corrosion still occur
Solution Approach 1:
The anchor layer serves as a protective intermediary that remains effective across the temperature ranges used for both soldering and brazing processes. It prevents harmful interactions between the bonding materials (solder or brazing material) and the thermoelectric element, allowing manufacturers to choose appropriate bonding methods based on temperature requirements without worrying about component diffusion or electrode corrosion.
3Strength
If bonding layer components diffuse into the thermoelectric element, then bonding is achieved, but electrical resistance or thermal resistance increases
Solution Approach 1:
The anchor layer acts as a diffusion barrier that prevents bonding layer components from migrating into the thermoelectric element. This intermediary layer maintains low electrical and thermal resistance at the interface by blocking the diffusion path, while still providing adequate bonding strength through its structural integrity and interfacial adhesion.
Solution Approach 2:
The anchor layer functions as a thin film barrier that effectively blocks component diffusion while maintaining good thermal and electrical contact. This thin film structure provides sufficient protection against resistance increase without introducing significant thermal or electrical impedance of its own.
Data Source
AI summary
A thermoelectric module includes a thermoelectric element disposed between a pair of electrodes, and an anchor layer disposed between the electrode and the thermoelectric element and connected with the thermoelectric element.