Thermoelectric Circuit Board Structure for Image Sensor Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing power consumption of image sensors due to improved image quality leads to heat dissipation challenges, potentially causing hot pixels and damaging image quality if not effectively addressed.
Innovation Solution
A circuit board with a refrigeration structure is designed, featuring a main board with internal and external structures, thermistor layers, N-type and P-type semiconductor units, and a thermal conductive layer, which collectively provide effective heat dissipation by removing heat energy from the image sensor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If merely using a metal layer under the image sensor for heat dissipation, then the structure is simple, but the power consumption of the image sensor cannot be effectively dissipated when the image sensor works for a long time or provides a higher image quality
Solution Approach 1:
The circuit board is divided into multiple functional layers including first and second bonding layers, thermistor layers, N-type semiconductor units, P-type semiconductor units, and thermal conductive layers. This segmentation allows each layer to perform specific heat dissipation functions, transforming the single metal layer into a multi-layered heat management system that effectively dissipates heat while maintaining manufacturability
Solution Approach 2:
The invention uses composite material structures combining different materials with complementary properties: metal layers for electrical conductivity, thermistor materials for temperature sensing, semiconductor materials for active cooling, and thermal conductive materials for heat transfer. This composite approach enables effective heat dissipation while maintaining structural integrity and ease of manufacture
2Manufacturing precision
If increasing the power consumption to improve image quality, then the image quality gets better, but the heat dissipation requirement increases
Solution Approach 1:
The thermistor layer is positioned adjacent to the image sensor to continuously monitor its temperature. This temperature feedback is used to control the activation and power level of the Peltier effect cooling units, enabling dynamic adjustment of cooling intensity based on real-time temperature conditions, thus maintaining optimal image quality while managing heat dissipation requirements
Solution Approach 2:
The invention changes the thermal parameters of the circuit board by introducing active cooling elements (Peltier effect units) and thermal management layers. This transforms the passive thermal conduction system into an active thermal control system, allowing the board to maintain lower operating temperatures even when the image sensor consumes higher power for improved image quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The refrigeration structure effectively dissipates heat energy from the circuit board, preventing hot pixels and maintaining image quality by adjusting the cooling effect according to demand.
Implementation Method 1
a plurality of Peltier effect cooling units, and a plurality of thermistor units; the Peltier effect cooling units remove heat energy of the image sensor
Implementation Method 2
The thermal conductive layer is disposed on the thermistor layer
Data Source
AI summary
A circuit board includes a main board, a thermistor layer, a plurality of n-type semiconductor units and a plurality of p-type semiconductor units. The main board includes a first external structure, a second external structure, and an internal structure disposed between the first external structure and the second external structure. The internal structure includes a first internal circuit layer, a second internal circuit layer, and an insulating layer disposed between the first internal circuit layer and the second internal circuit layer. The thermistor layer is disposed on the insulating layer and the first internal circuit layer. The n-type semiconductor units and the p-type semiconductor units are electrically connected to the second internal circuit layer and the second external structure, in which the n-type semiconductor units and the p-type semiconductor units are alternately arranged in one direction.