Thermoelectric Chip Concave Surface Joining
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Solution Overview
Problem
The existing methods for forming thermoelectric element layers, such as screen printing, result in insufficient shape controllability and bleeding at the electrode interface, leading to non-uniform thickness and surface shapes, which compromises the joining properties and thermoelectric performance of n-type thermoelectric conversion devices.
Innovation Solution
A chip of thermoelectric conversion material with a concave surface, where the joining material layer is filled in the concave, enhancing the joining properties to the electrode, with specific dimensions and shapes like rectangular parallelepiped or cubic, to improve shape controllability and thermoelectric performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If screen printing method is used to form thermoelectric element layer, then formation process is simple, but shape controllability is insufficient and bleeding occurs at electrode interface
Solution Approach 1:
The patent applies preliminary action by forming a convex portion on the thermoelectric element layer before joining to the electrode. This pre-formed convex structure prevents bleeding at the electrode interface during the joining process, ensuring precise shape control while maintaining the simplicity of the screen printing formation method.
Solution Approach 2:
The patent introduces a dimensional change by creating a convex portion that protrudes from the surface of the thermoelectric element layer toward the electrode. This three-dimensional structural modification allows the layer to maintain both ease of manufacture through simple formation processes and high shape controllability by preventing material bleeding at the interface.
2Ease of manufacture
If thermoelectric element layer is formed with non-uniform thickness, then formation process is easier, but joining properties to electrode deteriorate
Solution Approach 1:
The patent applies local quality by creating a convex portion with specific dimensional characteristics at a localized region of the thermoelectric element layer. This local structural enhancement ensures sufficient joining material layer thickness at the electrode interface, thereby improving joining properties while allowing the rest of the layer to be formed with varying thickness for manufacturing ease.
3Device complexity
If joining material layer is insufficient, then device structure is simpler, but interface resistance and thermal resistance increase
Solution Approach 1:
The patent applies preliminary action by pre-forming a convex portion on the thermoelectric element layer before applying the joining material layer. This preliminary structural preparation ensures that the joining material layer achieves sufficient thickness and proper distribution, thereby reducing interface and thermal resistance without complicating the overall device structure.
Data Source
AI summary
A chip of thermoelectric conversion material may have a concave portion and may be capable of realizing high joining properties to an electrode. Such a chip of thermoelectric conversion material may have a concave on at least one surface of the chip of thermoelectric conversion material. The shape of such chips of may be rectangular parallelepiped, cubic, and/or columnar shape.