Thermoelectric Chip Temperature Control With Dynamic Target Setting
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Solution Overview
Problem
Existing temperature control methods for optoelectronic components, such as those in Erbium Doped Fibre Amplifier designs, face challenges in optimizing heat dissipation and power consumption, leading to increased chip failure rates when maintaining a high target Chip on Carrier temperature to minimize temperature difference between the casing and chip, which results in higher power consumption and heat dissipation.
Innovation Solution
An electronic assembly comprising a heat sink and a thermoelectric cooler with a Negative Temperature Coefficient (NTC) Thermistor coupled to the device and a Positive Temperature Coefficient (PTC) Thermistor coupled to the heat sink, where the combined property of both Thermistors is maintained at a constant value, allowing the device temperature to dynamically adjust with the heat sink temperature, thereby controlling power consumption and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by stationary object
If the target Chip on Carrier temperature is set to a high value (e.g. 40°C) to minimize temperature difference and reduce TEC power consumption, then power consumption is reduced, but chip failure rate (FIT rate) doubles
Solution Approach 1:
The patent applies dynamics by making the target Chip on Carrier temperature adjustable rather than fixed. The system dynamically adjusts the target temperature based on operating conditions, allowing it to operate at higher temperatures (reducing TEC power consumption) when reliability requirements are lower, and maintain lower temperatures (improving reliability) when needed. This resolves the contradiction by enabling the system to adapt between the two conflicting requirements rather than being locked into a fixed high temperature setting.
2Use of energy by moving object
If the target CoC temperature is increased to reduce ΔT and minimize TEC current, then TEC power consumption decreases, but the FIT rate increases significantly
Solution Approach 1:
The patent applies parameter changes by adjusting the target Chip on Carrier temperature as a variable parameter based on system conditions. Rather than maintaining a constant high target temperature that reduces TEC current but increases FIT rate, the system changes the target temperature parameter dynamically. This allows optimization of TEC current consumption while managing FIT rate through intelligent parameter adjustment rather than fixed high-temperature operation.
3Stability of the object's composition
If a feedback loop controls TEC current to maintain a fixed target temperature, then temperature stability is achieved, but TEC power consumption increases when casing temperature is high
Solution Approach 1:
The patent resolves this contradiction by making the target temperature dynamic rather than fixed. Instead of maintaining a rigid fixed target temperature that requires high TEC power consumption when casing temperature is high, the system dynamically adjusts the target temperature to account for casing temperature variations. This maintains adequate temperature stability while reducing TEC power consumption by adapting to changing thermal conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the power consumption of the thermoelectric cooler while minimizing the impact on chip failure rates by maintaining a stable temperature relationship between the device and heat sink, thereby optimizing cooling power and reducing the chip failure rate.
Implementation Method 1
A TEC is a solid-state active heat pump device which uses the Peltier effect to transfer heat from one side of the device to the other side against the temperature gradient (from cold to hot), with consumption of electrical energy.
Implementation Method 2
A first temperature-responsive electrical element which is thermally coupled to the device and a second temperature-responsive electrical element which is thermally coupled to the heat sink. The first element has a property which varies with temperature in a first direction, and the second element has the same property, but which varies with temperature in the opposite direction.
Data Source
AI summary
There is disclosed an electronic apparatus comprising a chip within a casing. A thermoelectric cooler has thermal connections to the chip and the casing and is configured to transport heat from the chip to the casing. A temperature measuring device is provided for determining the temperature of the chip. A control system is configured to maintain the chip at a target temperature by controlling current supplied to the thermoelectric cooler in response to the measured temperature. A temperature selection system is configured to select the chip target temperature dynamically on the basis of the casing temperature.