Thermoelectric Cooler Controller Integration for Reduced Footprint
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Solution Overview
Problem
Existing thermal management systems for electronic components require separate controller enclosures, leading to increased space and complexity due to hardwired connections, making them difficult to install and modify within fireproof or secure main enclosures.
Innovation Solution
A compact thermal management system with a thermoelectric cooling unit and controller integrated within the enclosure, utilizing quick connectors for simplified power management and reduced form factor, allowing the controller to be mounted internally without an external enclosure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the controller is mounted outside the main enclosure with a separate controller enclosure, then the controller is protected and hardwired connections are secure, but the space requirements increase and installation complexity increases
Solution Approach 1:
The controller is integrated directly into the main enclosure, eliminating the need for a separate controller enclosure. The controller mounts inside the main enclosure using standard mounting techniques, combining the previously separate controller enclosure and main enclosure into a single integrated structure, thereby reducing overall space requirements while maintaining controller protection.
Solution Approach 2:
The controller is nested within the main enclosure space, utilizing the existing enclosure volume rather than requiring external space. This nesting approach allows the controller to be housed within the same boundary as the equipment it controls, reducing the total footprint of the installed system.
2Reliability
If hardwired connections are used for power and control signals, then electrical connections are secure and reliable, but installation and modification become more complex and time-consuming
Solution Approach 1:
The electrical connections are segmented into modular connector interfaces rather than requiring hardwired point-to-point connections. The controller uses standardized connectors for power input, power output to the cooling unit, and communication interfaces, allowing for quick plug-and-play installation and easy modification without complex wiring work.
Solution Approach 2:
The connector interfaces are pre-configured and pre-assembled on the controller board during manufacturing, with terminal blocks and connection points prepared in advance. This preliminary preparation of connection interfaces enables rapid field installation and modification without requiring complex wiring assembly during installation.
3Device complexity
If the controller uses a larger form factor with traditional mounting, then all control components and connections are accommodated, but the controller does not meet space constraints within the main enclosure
Solution Approach 1:
The controller utilizes vertical mounting space and three-dimensional enclosure volume rather than only horizontal surface area. The controller is mounted on interior surfaces or brackets that exploit the depth and height dimensions of the main enclosure, allowing full functionality to be accommodated within the existing footprint constraints.
Solution Approach 2:
The controller employs a compact, thin-profile form factor with a slim circuit board and minimized component height, allowing it to fit within the limited space of the main enclosure. The controller design uses space-efficient PCB layout and surface-mount components to reduce the overall footprint while maintaining all necessary control functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces space requirements, simplifies installation and modification, and maintains effective cooling while ensuring the controller is protected within the main enclosure, enhancing operational efficiency and safety.
Implementation Method 1
a thermoelectric cooling unit mounted on the enclosure such that the cooling unit cools an interior space of the enclosure
Implementation Method 2
The cooling unit has a fan for driving air into the interior space
Data Source
AI summary
A thermal management system for an enclosure containing electrical components includes a thermoelectric cooling unit for controlling temperature inside the enclosure and a controller for the cooling unit, the controller being configured so that it can be installed within and protected by the enclosure, rather than requiring its own separate secure enclosure. The controller can further be installed within a housing of the thermoelectric cooling unit, which housing does not increase the footprint of the cooling unit.