Substrate temperature control with integrated thermoelectric cooling system
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Solution Overview
Problem
Existing substrate processing systems face limitations in temperature control range and efficiency due to mechanical constraints, power requirements, and cooling technology, particularly in achieving a wide temperature differential for substrate supports like electrostatic chucks (ESCs).
Innovation Solution
A dual temperature control system incorporating a thermoelectric module that heats and cools return coolant, reducing the load on the coolant assembly by regulating the temperature of the return coolant before it is supplied to the coolant reservoirs, thereby enhancing temperature control capabilities and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional coolant assembly is used to control substrate support temperature, then the system can provide basic cooling, but the temperature control range is limited and cannot achieve wide temperature differential
Solution Approach 1:
The coolant flow path is segmented into multiple channels (first channel, second channel, third channel) with different thermal treatments. The thermoelectric module is integrated into specific channels to provide localized heating or cooling, enabling the system to achieve wide temperature differential across the substrate support while maintaining efficient heat transfer pathways.
Solution Approach 2:
The thermoelectric module acts as an intermediary device between the coolant assembly and the substrate support. It selectively heats or cools the coolant in specific channels, transforming the conventional single-function coolant system into a dual temperature control system that can maintain both cold and hot coolant streams simultaneously.
2Temperature
If the coolant assembly works harder to achieve wider temperature range, then temperature control capability improves, but power requirements and energy consumption increase
Solution Approach 1:
The thermoelectric module utilizes the temperature difference between coolant channels to generate electrical power through the Seebeck effect. This self-generated power is used to drive the thermoelectric cooling/heating process, significantly reducing the external power requirements and energy consumption of the temperature control system.
Solution Approach 2:
The system changes the thermal parameters of the coolant dynamically by using the thermoelectric module to selectively heat or cool specific coolant channels based on process requirements. This allows the system to achieve wide temperature range without proportionally increasing the overall power consumption, as the thermoelectric effect efficiently converts thermal gradients into electrical energy.
3Measurement precision
If advanced cooling technology is implemented to achieve precise temperature control, then temperature precision improves, but device complexity and footprint increase
Solution Approach 1:
The thermoelectric module is integrated directly into the coolant assembly structure, merging the temperature control function with the existing coolant distribution system. This integration eliminates the need for separate complex cooling subsystems, reducing overall device complexity while maintaining precise temperature control capability through the manifold's distributed thermal management.
Solution Approach 2:
The thermoelectric module serves multiple functions simultaneously: it can heat coolant, cool coolant, generate electrical power from temperature gradients, and provide precise temperature control. This multi-functionality reduces the need for separate dedicated components for each function, thereby simplifying the overall system architecture while achieving precise temperature regulation.
4Temperature
If the coolant assembly is enlarged to provide both heating and cooling capacity, then temperature control range improves, but the footprint and system size increase
Solution Approach 1:
The thermoelectric module is nested within the existing coolant assembly structure, utilizing the available space in the manifold and coolant channels. This nested integration allows the system to provide both heating and cooling capabilities within the original footprint, eliminating the need for separate external heating and cooling units that would increase the overall system size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves precise temperature control of substrate supports from -60 to 80°C with reduced heating and cooling power requirements, increased cooling capacity, and a decreased footprint, while maintaining temperature consistency and efficiency.
Implementation Method 1
A thermoelectric module arranged in a flow path between the manifold assembly and the coolant assembly is configured to receive the return coolant from the manifold assembly, either one of heat and cool the return coolant
Implementation Method 2
The thermoelectric module may be a single stage or multi-stage thermoelectric cooler
Data Source
AI summary
A temperature control system for a substrate support in a processing chamber includes a manifold assembly configured to supply a liquid coolant at a first temperature from a first channel of a coolant assembly to the processing chamber, supply the liquid coolant at a second temperature from a second channel of the coolant assembly to the processing chamber, and supply return coolant from the processing chamber to the coolant assembly. A thermoelectric module arranged in a flow path between the manifold assembly and the coolant assembly is configured to receive the return coolant from the manifold assembly, either one of heat and cool the return coolant, and supply heated return coolant and cooled return coolant to the coolant assembly.