Thermoelectric Cooler, Optical Sub-Assembly, and Optical Module
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Solution Overview
Problem
As optical sub-assemblies evolve to higher speeds, the increasing power consumption and heat generation in laser chips and electronic components within thermoelectric coolers (TECs) pose challenges for effective heat dissipation, affecting performance.
Innovation Solution
A TEC design with a first and second base plate and multiple couples of elements arranged in a density gradient configuration within an accommodation space, connected to an external power source to control temperature, enhancing heat dissipation from a heat source device by varying voltage or current, and optionally incorporating support bodies and secondary elements in less dense areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the optical sub-assembly is developed toward high speed (from 100G to 400G TOSA), then the transmission speed and data rate are improved, but the power consumption and heat generation of the laser chip and electronic components increase
Solution Approach 1:
The patent applies local quality by creating different element densities in different regions of the TEC. The first area (under the heat source device) has a first density of thermoelectric elements, while the second area (away from the heat source) has a second density that is less than the first density. This localized differentiation optimizes heat dissipation where needed most while reducing unnecessary complexity elsewhere, directly addressing the heat generation problem associated with high-speed optical sub-assemblies.
2Productivity
If the power consumption of laser chip and electronic components increases to achieve high speed transmission, then the transmission performance is improved, but the heat dissipation becomes more difficult and affects device performance
Solution Approach 1:
The patent implements local quality by configuring the TEC with non-uniform element distribution. The first area corresponding to the heat source device contains thermoelectric elements at a first density, while the second area contains elements at a lower second density. This localized optimization enhances heat dissipation capability precisely where the high power consumption components generate the most heat, thereby maintaining transmission performance without compromising thermal management.
3Ease of manufacture
If uniform density of thermoelectric elements is used throughout the TEC, then the manufacturing process is simplified, but the heat dissipation efficiency is reduced due to insufficient cooling capacity in high-heat areas
Solution Approach 1:
The patent resolves this contradiction by applying local quality through differentiated element density configuration. Rather than using uniform density throughout, the TEC has a first area with higher element density for optimal heat dissipation and a second area with lower element density. This approach maintains manufacturing feasibility while significantly improving heat dissipation efficiency in the critical high-heat regions, thereby enhancing overall device reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively maintains the heat source device at a constant temperature, improving heat dissipation and reducing temperature fluctuations, thereby enhancing the thermal stability and performance of the optical sub-assembly.
Implementation Method 1
multiple couples of first elements are all connected to the first base plate and the second base plate, the multiple couples of first elements are connected to an external power source to adjust a temperature difference between the first base plate and the second base plate by changing a voltage or a current and implement temperature control on the heat source device
Data Source
AI summary
A thermoelectric cooler (TEC) configured to support a heat source device and perform temperature control on the heat source device. The TEC includes a first base plate, a second base plate disposed opposite to the first base plate, and first elements. The first base plate is configured to support the heat source device. An accommodation space is formed between the first base plate and the second base plate. The first elements are arranged at intervals within the accommodation space, and are all connected to the first base plate and the second base plate.