Thermoelectric cooling module, optical device and optical module
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Solution Overview
Problem
High-speed optical sub-assemblies face challenges in effective heat dissipation due to increased power consumption and heat generation, affecting performance, particularly in thermoelectric coolers used for temperature control in laser chips and electronic components.
Innovation Solution
A thermoelectric cooler design with a first and second base plate, featuring multiple couples of elements arranged in a configuration where density decreases from a high-density area corresponding to the heat source to a lower-density area, connected in series and powered by an external source to manage temperature differences, along with a temperature detector and control circuit for precise temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the optical sub-assembly is developed toward high speed (from 100G TOSA to 400G TOSA), then the transmission rate is improved, but power consumption and heat generation increase, affecting performance
Solution Approach 1:
The patent applies local quality by creating a non-uniform density distribution of thermoelectric elements within the TEC module. The first region (closer to the heat source) has a higher density of thermoelectric element couples, while the second region has a lower density. This gradient distribution optimizes heat dissipation efficiency at different locations, matching the heat generation profile of high-speed optical components and improving overall thermal management performance.
2Ease of manufacture
If a conventional TEC with uniform element distribution is used, then the structure is simple, but heat dissipation effectiveness is insufficient for high-power components
Solution Approach 1:
The patent implements local quality through a gradient density arrangement of thermoelectric elements. The first region contains a higher density of element couples to handle concentrated heat from high-power optical components, while the second region has lower density. This non-uniform distribution optimizes heat dissipation effectiveness without significantly complicating the manufacturing process, as it maintains the basic TEC structure while adjusting element placement density.
3Loss of energy
If the density of thermoelectric elements is increased throughout the entire TEC, then heat dissipation capacity is improved, but the coefficient of performance (COP) decreases due to unnecessary elements in low-heat areas
Solution Approach 1:
The patent optimizes COP by applying local quality through spatially varying element density. The first region has high density to efficiently dissipate heat from high-power components, while the second region has lower density where less heat is generated. This prevents waste of electrical energy on thermoelectric elements that would not be fully utilized, thereby improving the overall coefficient of performance while maintaining adequate heat dissipation capacity.
Solution Approach 2:
The patent applies parameter changes by varying the density parameter of thermoelectric elements across different regions of the TEC. The density transitions from a uniform value in conventional designs to a gradient distribution where the first region has higher density and the second region has lower density. This parameter optimization balances heat dissipation requirements with energy efficiency, improving COP.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation from the heat source, maintaining a constant temperature and improving the coefficient of performance (COP) of the thermoelectric cooler, effectively addressing the issue of uneven heat distribution and performance degradation in high-speed optical sub-assemblies.
Implementation Method 1
the multiple couples of first elements are connected to an external power source to adjust a temperature difference between the first base plate and the second base plate by changing a voltage or a current
Data Source
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AI summary
A thermoelectric cooler (20) is configured to support a heat source device (12) and perform temperature control on the heat source device (12). The thermoelectric cooler (20) includes a first base plate (21), a second base plate (23) disposed opposite the first base plate (21), and multiple couples of first elements (25). The first base plate (21) is configured to support the heat source device (12). An accommodation space (26) is formed between the first base plate (21) and the second base plate (23). The multiple couples of first elements (25) are arranged at intervals within the accommodation space (26), and are all connected to the first base plate (21) and the second base plate (23). The multiple couples of first elements (25) are connected to an external power source to adjust a temperature difference between the first base plate (21) and the second base plate (23) by changing a voltage or a current and implement temperature control on the heat source device (12). The accommodation space includes a first area (261) and a second area (263) adjacent to the first area. The first area (261) is disposed in a correspondence to the heat source device (12). Density of first elements (25) in the first area (261) is greater than density of first elements (25) in the second area (263).