Electrical device thermal regulation system with thermoelectric cooler module
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Solution Overview
Problem
Existing temperature control systems for electronic devices struggle to maintain precise temperature control, especially in devices with complex geometries or those requiring localized temperature regulation.
Innovation Solution
The use of one or more thermoelectric cooler (TEC) modules, which are strategically positioned between an inner and outer housing to control the temperature of electronic components. The TEC modules are designed to conform to the shape of the housings, allowing for effective temperature regulation in curved, angular, or irregularly shaped devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional temperature control systems are used, then temperature regulation is achieved, but precision and adaptability to complex geometries deteriorate
Solution Approach 1:
The patent applies local quality by shaping the TEC module to conform to specific geometric features of the housing (curved, angular, or irregular surfaces). Different portions of the TEC module have different shapes tailored to match local housing geometries, enabling precise temperature control adapted to complex surfaces while maintaining high measurement and control precision
Solution Approach 2:
The patent implements dynamics by making the TEC module flexible or adjustable in shape rather than rigid. The module can be deformed or reconfigured to adapt to different housing geometries, allowing the same temperature control system to work effectively across varied complex shapes while maintaining precision
2Adaptability or versatility
If TEC modules are shaped to conform to housing geometries, then adaptability to complex shapes improves, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the TEC module into multiple sections or segments, each shaped to conform to specific geometric features of the housing. This modular approach allows each segment to be manufactured separately using standard techniques, then assembled together to create the overall conformal shape, reducing individual manufacturing complexity while achieving adaptability
Solution Approach 2:
The patent employs flexible shells or thin film structures for the TEC module, allowing it to be formed into complex shapes more easily. These flexible materials can be molded or shaped to conform to housing geometries without requiring complex rigid manufacturing processes, thereby improving adaptability while managing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise temperature control of electronic devices, allowing for both heating and cooling functions. The TEC modules can sense temperatures and adjust accordingly, maintaining the device within a specified temperature range, even in devices with complex geometries.
Implementation Method 1
A thermoelectric cooler (TEC), also referred to as a Peltier cooler, is a semiconductor-based electronic component that functions as a solid state heat pump. Direct current (DC) electric current applied to the terminals of the TEC results in a thermal temperature difference.
Data Source
AI summary
A system comprising: an inner housing; an electronic device disposed within the inner housing, the electronic device comprising processing circuitry and generator circuitry; an outer housing; and a thermoelectric cooler (TEC) disposed between the inner housing and the outer housing, the TEC comprising: a first surface thermally coupled to the inner housing, and a second surface thermally coupled to the outer housing, wherein the processing circuitry is coupled to the TEC, and is configured to: receive electrical signals; determine the temperature of the inner housing based on the received electrical signals; compare the determined temperature against a threshold temperature; and based on a determination that the determined temperature does not satisfy the threshold temperature, cause the generator circuitry to deliver DC electric current to the TEC to cause the TEC to modulate the temperature of the inner housing.