Electrical device thermal regulation system with thermoelectric cooler module
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Solution Overview
Problem
Existing thermal regulation systems for electronic devices struggle to maintain precise temperature control, especially in devices with complex geometries or those requiring localized temperature modulation.
Innovation Solution
The use of one or more thermoelectric cooler (TEC) modules, strategically positioned between an inner and outer housing, to control the temperature of electronic components. The TEC modules are configured to conform to the shape of the housings and can be individually activated to manage temperature fluctuations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional thermal regulation systems are used, then temperature control is achieved, but precision is insufficient especially for complex geometries
Solution Approach 1:
The thermal regulation system is divided into multiple independently controllable TEC modules distributed across different surfaces. Each module can be individually activated or deactivated based on localized temperature requirements, enabling precise control for complex geometries while maintaining overall temperature precision.
Solution Approach 2:
Different regions of the device are equipped with TEC modules having different thermal characteristics and control parameters tailored to local requirements. This allows each region to be optimized for its specific thermal needs, improving both local temperature precision and adaptability to varying geometric complexities.
2Measurement precision
If TEC modules are added for precise temperature control, then temperature precision improves, but device complexity increases
Solution Approach 1:
Multiple TEC modules are electrically connected in series or parallel configurations and integrated into a unified control system. This merging approach allows simultaneous control of multiple modules through coordinated current regulation, achieving precise temperature control while managing system complexity through integrated architecture.
Solution Approach 2:
The TEC modules serve dual functions: they provide both heating and cooling capabilities depending on current direction, and can be used for both temperature regulation and temperature sensing through their electrical characteristics. This multi-functionality reduces the need for separate components, thereby managing complexity while maintaining precision.
3Measurement precision
If TEC modules are used for temperature control, then temperature precision improves, but energy consumption increases
Solution Approach 1:
The TEC modules operate in periodic cycles rather than continuously, switching between heating and cooling modes based on real-time temperature feedback. This periodic operation allows the system to achieve precise temperature control while minimizing energy consumption by avoiding continuous high-power operation.
Solution Approach 2:
The system dynamically adjusts the current magnitude and polarity applied to TEC modules based on temperature requirements. By varying electrical parameters (current level, duty cycle) according to actual thermal needs, the system maintains temperature precision while optimizing energy efficiency and reducing overall power consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise temperature control of electronic devices, even in complex geometries, by effectively transferring thermal energy between the TEC modules and the device housings, thereby maintaining optimal operating temperatures.
Implementation Method 1
A thermoelectric cooler (TEC), also referred to as a Peltier cooler, is a semiconductor-based electronic component that functions as a solid state heat pump. Direct current (DC) electric current applied to the terminals of the TEC results in a thermal temperature difference.
Data Source
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AI summary
A system comprising: an inner housing; an electronic device disposed within the inner housing, the electronic device comprising processing circuitry and generator circuitry; an outer housing; and a thermoelectric cooler (TEC) disposed between the inner housing and the outer housing, the TEC comprising: a first surface thermally coupled to the inner housing, and a second surface thermally coupled to the outer housing, wherein the processing circuitry is coupled to the TEC, and is configured to: receive electrical signals; determine the temperature of the inner housing based on the received electrical signals; compare the determined temperature against a threshold temperature; and based on a determination that the determined temperature does not satisfy the threshold temperature, cause the generator circuitry to deliver DC electric current to the TEC to cause the TEC to modulate the temperature of the inner housing.