Thermoelectric Cooling Module With Circuit Board Conducting Members
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Solution Overview
Problem
Traditional thermoelectric cooling modules face issues with high energy consumption in sintering and mold manufacturing, poor heat conduction due to large thermal resistance, and lack of flexibility and structural tenacity, leading to potential damage from vibration and thermal shock.
Innovation Solution
A thermoelectric cooling module using circuit boards with penetrating holes and conducting members to directly conduct heat from TED chips, enhancing conductivity and structural strength, and allowing for flexible configuration and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by stationary object
If ceramic substrates are used in traditional thermoelectric cooling modules, then structural stability is provided, but the sintering and mold manufacturing processes consume much energy and the copper plate cannot be firmly fixed to the ceramic substrate
Solution Approach 1:
The patent changes the material parameter from ceramic substrate to circuit board, which has different physical and chemical properties. The circuit board uses lower energy manufacturing processes and provides better adhesion for copper plates through its surface characteristics, thereby reducing energy consumption while improving fixing reliability.
Solution Approach 2:
The patent employs a composite structure where the circuit board serves as the base material and copper plates are attached as functional layers. This composite approach combines the advantages of both materials: the circuit board provides low-energy manufacturing and good adhesion, while the copper plates provide thermal conduction functionality.
2Temperature
If copper plate and ceramic substrate are used as heat conduction path, then thermal conduction is achieved, but the thermal resistance is large and quick thermal conduction cannot be achieved
Solution Approach 1:
The patent extracts the copper plate from the intermediate heat conduction path and directly attaches it to the TED chip. This eliminates the ceramic substrate interface from the heat conduction path, removing the thermal resistance barrier and enabling direct thermal coupling between the heat source and heat dissipation structure.
Solution Approach 2:
The patent introduces the circuit board as a new intermediary material between the TED chip and the external environment. The circuit board's surface allows direct attachment of copper plates, creating an efficient thermal interface that reduces thermal resistance compared to the traditional ceramic substrate approach.
3Strength
If ceramic substrate is used, then structural support is provided, but the flexibility of configuring and the tenacity are poor, making it easy to crack or break under vibration and thermal shock
Solution Approach 1:
The patent changes the material parameter from ceramic to circuit board, which fundamentally alters the mechanical properties. The circuit board exhibits higher flexibility and tenacity due to its polymeric or composite structure, allowing it to withstand vibration and thermal shock without cracking, while also enabling flexible configuration adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent heat dissipation efficiency, structural integrity, and flexibility, reducing the risk of damage from vibrations and thermal shocks while maintaining stable electrical conduction.
Implementation Method 1
the heat generated by a TED chip can be conducted to the outside directly through a first conducting member and a second conducting member
Implementation Method 2
the circuit board with circuits comes with good elasticity and tenacity
Data Source
AI summary
A thermoelectric cooling module includes a first circuit board, a second circuit board, first conducting members, second conducting members and TED chips. The first circuit board includes first circuit regions, each having a first conducting layer and first penetrating holes; the second circuit board includes second circuit regions, each having a second conducting layer and second penetrating holes; each first conducting member is passed and fixed into each respective first penetrating hole; each second conducting member is passed and fixed into each respective second penetrating hole; each TED chip is clamped between the first circuit board and the second circuit board, and each first conducting member has an end attached to the TED chip and the other end attached to the first conducting layer, and each second conducting member has an end attached to the TED chip and the other end attached to the second conducting layer.