Active Thermoelectric Cooling Pad with Infrared Sensor
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Solution Overview
Problem
Computing systems, particularly laptops and tablets, face challenges in efficient heat dissipation due to the trend towards portability and the need for more powerful components, leading to overheating issues despite advancements in cooling technologies that often compromise on power consumption, noise, and space.
Innovation Solution
A cooling pad utilizing thermoelectric technology that actively reduces the temperature of computing systems by transferring heat from the top surface to a heat sink, which is then dissipated using a radiator, powered by an internal battery or USB type-C port, and enhanced with a semi-closed fan design for noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If robust cooling systems are used to cool powerful components, then heat dissipation is improved, but device size and weight increase
Solution Approach 1:
The cooling system is nested within a compact housing that integrates the heat sink, thermoelectric cooler, and fan into a space-efficient configuration. The aluminum housing encloses all cooling components, allowing them to be stacked vertically rather than spread out horizontally, thus reducing the overall footprint while maintaining effective heat dissipation capacity.
Solution Approach 2:
The cooling pad utilizes a thin aluminum housing that serves as both structural support and thermal management component. The aluminum material provides excellent thermal conductivity in a minimal thickness, allowing efficient heat transfer from the computing system to the heat sink without requiring bulky cooling structures.
2Temperature
If active cooling systems are used to maintain low temperatures, then temperature control is improved, but power consumption increases
Solution Approach 1:
The system dynamically adjusts cooling intensity by changing the power supplied to the thermoelectric cooler and fan based on real-time temperature readings from the thermal sensor. When the computing system temperature is below the threshold, cooling is reduced or stopped, minimizing power consumption. When temperature exceeds the threshold, cooling intensity increases proportionally to maintain efficient operation.
Solution Approach 2:
A thermal sensor continuously monitors the temperature of the computing system and provides feedback to the control circuitry. This feedback loop enables the system to activate or deactivate cooling functions based on actual thermal conditions, ensuring that power is consumed only when necessary for heat dissipation, thus optimizing the balance between temperature control and energy efficiency.
3Temperature
If high-speed fans are used for heat dissipation, then cooling efficiency is improved, but noise increases
Solution Approach 1:
The fan operates dynamically with variable speed control based on thermal conditions. The control circuitry adjusts fan RPM according to the temperature readings from the thermal sensor, running the fan at high speed only when heat dissipation is critical and at lower speeds or idle when cooling demand is reduced, thus minimizing noise generation while maintaining cooling effectiveness when needed.
Solution Approach 2:
The cooling system operates in periodic cycles, activating the fan and thermoelectric cooler only when the thermal sensor detects temperatures above the predetermined threshold. This on-demand periodic operation reduces overall noise exposure compared to continuous high-speed fan operation, while still maintaining effective heat dissipation during peak thermal loads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling pad effectively manages heat dissipation by maintaining the computing system at a lower temperature, enhancing the efficiency of internal cooling systems and reducing noise, while being portable and energy-efficient.
Implementation Method 1
The temperature of the upper surface of the cooling pad is reduced using thermoelectric technology. Thermoelectric technology then starts transferring heat from the top plate of the cooling pad to the heat sink.
Implementation Method 2
The heat sink presents one flat side aimed at collecting heat from a hot source on the computing system and a radiator to dissipate it.
Implementation Method 3
the flat fan of the cooling pad is powered up to blow air at room temperature through the heat sink radiator
Implementation Method 4
An infrared thermal sensor monitors the temperature of the computing system placed on top of the cooling pad.
Data Source
AI summary
A cooling pad to dissipate heat from a portable computing system. The cooling pad of the present invention includes a fan, heat sink and thermal sensor inside the cooling pad housing. When the cooling pad heat sink is placed next to the portable computing system and its thermal sensor detects a portable computing system temperature above a pre-determined threshold, the fan in the cooling pad can turn on to dissipate heat from the cooling pad's heat sink and thereby also dissipate heat from the portable computing system.