Thermoelectric Cooling Mechanism in Semiconductor Redistribution Layer

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Solution Overview

Problem

The miniaturization of semiconductor devices poses challenges in thermal management and heat dissipation due to high power density, which can lead to decreased performance and reliability of semiconductor structures.

Innovation Solution

A semiconductor structure is designed with a cooling mechanism that includes a redistribution layer with a dielectric layer, interconnect structure, and a thermoelectric cooling system comprising conductive and thermoelectric members extending parallel to the surface, effectively dissipating heat to the periphery and maintaining performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If semiconductor devices are miniaturized to increase functionality and integration, then device functionality and integration density are improved, but thermal management becomes more difficult and heat dissipation efficiency deteriorates

Engineering Contradiction:

Improvedevice functionalityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent transitions from planar heat dissipation to three-dimensional heat dissipation by extending thermoelectric cooling members vertically through multiple die layers. The cooling members penetrate through first die, second die, and substrate layers, creating vertical thermal management pathways that enable effective heat dissipation in miniaturized, highly integrated 3D semiconductor structures without compromising device functionality.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If cooling mechanism is added to improve heat dissipation, then thermal management is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipationVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The thermoelectric cooling members serve multiple functions simultaneously: they provide thermal management by conducting heat away from hot spots, acts as structural support elements connecting multiple die layers, and enable electrical interconnection between layers. This multi-functionality reduces overall device complexity by combining cooling, structural, and electrical functions into single integrated components rather than requiring separate elements for each function.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the cooling mechanism with the electrical interconnect structure by integrating thermoelectric cooling members into the same vertical pathways used for electrical connections between die layers. This consolidation eliminates the need for separate cooling channels and electrical interconnects, thereby reducing structural complexity while achieving effective heat dissipation in the miniaturized device.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If conventional cooling mechanisms are used, then heat dissipation is achieved, but overall device thickness increases

Engineering Contradiction:

Improveheat dissipationVSAvoiddevice thickness

Core Design Contradiction:

TemperatureVSLength of stationary object

Solution Approach 1:

The cooling members are nested within the existing vertical structure of the semiconductor device, utilizing the same space occupied by electrical interconnects and die stacking pathways. The thermoelectric cooling members are positioned concentrically with or adjacent to electrical conductors, allowing heat dissipation functionality to be embedded within the existing device footprint without requiring additional lateral or vertical space, thus maintaining compact form factor.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The thermoelectric cooling mechanism efficiently dissipates heat, maintaining performance and reducing the overall thickness of the semiconductor structure, thereby enhancing reliability and minimizing the form factor.

Implementation Method 1

a cooling mechanism disposed within the dielectric layer, wherein the cooling mechanism includes a first conductive member, a second conductive member disposed opposite to the first conductive member, a first thermoelectric member and a second thermoelectric member adjacent to the first thermoelectric member

Methodology Applied

Scientific EffectThermoelectric cooling: Peltier Effect

Data Source

PatentUS10867892B1Semiconductor structure and manufacturing method thereof

Publication Date: 2020.12.15 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor structure includes a first die including a first surface and a second surface opposite to the first surface; a first molding surrounding the first die; and a first redistribution layer (RDL) disposed over the second surface of the first die and the first molding, and including a first dielectric layer, a first interconnect structure surrounded by the first dielectric layer, and a cooling mechanism disposed within the first dielectric layer, wherein the cooling mechanism includes a first conductive member, a second conductive member disposed opposite to the first conductive member, a first thermoelectric member and a second thermoelectric member adjacent to the first thermoelectric member; and wherein the first thermoelectric member and the second thermoelectric member extend substantially in parallel to the second surface of the first die and extend between the first conductive member and the second conductive member.