Thermoelectric Die Cooling for High-Heat Controller Packages
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Solution Overview
Problem
Current semiconductor packages generate significant heat due to high power and frequency operations, leading to die failure and premature aging, necessitating effective heat dissipation methods.
Innovation Solution
A thermoelectric semiconductor device is developed, incorporating a heat dissipating module with a thermoelectric semiconductor die mounted on a substrate, utilizing the Seebeck and Peltier effects to draw heat away from controller dies by creating a temperature gradient and voltage potential across p-n regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high power and high frequency operations are used in semiconductor packages, then processing speed and capacity are improved, but heat generation increases causing die failure and premature aging
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional passive heat sink approach and implements it through active thermoelectric cooling elements integrated into the semiconductor package. The Peltier element is positioned to directly contact the controller die, actively pumping heat away from the high-power components rather than relying on passive thermal conduction to external heat sinks.
Solution Approach 2:
The patent introduces thermoelectric cooling elements as intermediary components between the controller die and the external environment. These elements act as thermal mediators that actively transfer heat from the high-power controller die through thermoelectric conversion, enabling controlled heat management that protects the die while maintaining high operating speeds.
2Productivity
If high power operations are used in semiconductor packages, then processing capacity is improved, but die reliability deteriorates due to heat-induced failure
Solution Approach 1:
The patent implements preliminary cooling action by positioning thermoelectric cooling elements in direct thermal contact with the controller die before excessive heat accumulation occurs. The cooling system is pre-configured within the package structure, allowing immediate heat removal when high-power operations commence, thereby preventing heat-induced die failure and extending operational reliability.
Solution Approach 2:
The patent converts the harmful effect of heat generation into a beneficial cooling mechanism by utilizing the Peltier effect. The same electrical current that powers the high-capacity processing operations is redirected through thermoelectric elements to actively pump heat away from the controller die, transforming the waste heat problem into an active cooling solution that enhances die reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces operating temperatures, preventing die failure and extending the lifespan of semiconductor packages through passive and active heat dissipation mechanisms.
Implementation Method 1
utilizing the Seebeck and Peltier effects to draw heat away from controller dies by creating a temperature gradient and voltage potential across p-n regions
Implementation Method 2
utilizing the Seebeck and Peltier effects to draw heat away from controller dies by creating a temperature gradient and voltage potential across p-n regions
Data Source
AI summary
A thermoelectric semiconductor device includes a heat dissipating semiconductor module and a stack of flash memory dies mounted on a substrate. The heat dissipating module comprises a first semiconductor die such as a controller, and a second semiconductor die such as a thermoelectric semiconductor die to cool the first semiconductor die during operation. The thermoelectric semiconductor die may be mounted to the controller die at the wafer level.