Hybrid Thermoelectric-Ejector Cooling for High Temperature Differentials
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Solution Overview
Problem
Thermoelectric and ejector cooling systems face efficiency issues, particularly in applications requiring large temperature differentials, as heat transfer from the hot side to the cold side reduces the effectiveness of heat absorption in thermoelectric coolers and ejector devices.
Innovation Solution
A hybrid integrated cooling system combining a thermoelectric cooling device with an ejector cooling system, featuring a high temperature evaporator, a low temperature evaporator, a pump, a condenser, and micro/nano-structured surfaces for enhanced heat transfer, where the thermoelectric module's hot side supplies heat to vaporize a primary fluid, and the ejector module accelerates this fluid to create low pressure, drawing secondary fluid vapor for efficient heat absorption and rejection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermoelectric cooling is used to achieve large temperature differentials, then cooling capability is improved, but heat transfer from hot side to cold side increases reducing effectiveness
Solution Approach 1:
The system divides the cooling function into two separate modules: a thermoelectric cooling module for generating cold temperature and an ejector cooling module for heat rejection. This segmentation allows each module to operate optimally within its temperature range, preventing heat transfer losses that would occur in a single integrated system.
Solution Approach 2:
The ejector cooling module acts as an intermediary between the thermoelectric module and the external environment. It receives heat from the thermoelectric module's hot side and efficiently rejects it to the ambient environment, serving as a thermal mediator that prevents direct heat transfer losses.
2Ease of operation
If ejector cooling devices are used, then moving parts are eliminated, but efficiency problems occur in certain applications
Solution Approach 1:
The system merges the advantages of two different cooling technologies: the thermoelectric module provides efficient cooling with no moving parts, while the ejector module complements it by efficiently handling heat rejection. The combination achieves high efficiency while maintaining the advantage of having no moving parts.
Solution Approach 2:
The hybrid system creates a multi-functional cooling solution that can handle both low-temperature cooling and high-temperature heat rejection using different physical mechanisms. This universal approach allows the system to maintain high efficiency across a wide range of operating conditions.
3Device complexity
If thermoelectric cooling module rejects heat to ambient air, then heat rejection is simplified, but thermal efficiency decreases at high temperature differentials
Solution Approach 1:
The ejector cooling module uses fluid dynamics (pneumatics) to enhance heat rejection. The ejector uses high-velocity fluid flow to create a low-pressure region that facilitates efficient heat transfer from the thermoelectric module to the ambient environment, improving thermal efficiency while maintaining relatively simple device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves higher thermal efficiency by maximizing the coefficient of performance (COP) and enabling operation at higher temperature differentials than standalone thermoelectric cooling, with enhanced heat transfer coefficients through thin film evaporation and capillary action, eliminating the need for mechanical pumps.
Implementation Method 1
Thermoelectric coolers use the Peltier effect to create cooling on one side of a plate or the like
Implementation Method 2
A wick structure connecting the condenser to the high temperature evaporator so that the liquids in the condenser can travel from the condenser to the high temperature evaporator by way of capillary force
Implementation Method 3
enhanced thin film evaporation heat transfer
Data Source
AI summary
A hybrid thermoelectric-ejector active cooling system having an increased Coefficient of Performance (COP) when compared to typical thermoelectric cooling modules. A thermoelectric cooling module is integrated with an ejector cooling device so that heat from the thermoelectric cooling module is rejected to a high temperature evaporator of the ejector cooling device. This provides for a total COP greater than the sum of the COPs of the thermoelectric cooling module and ejector cooling device individually. For example, given 1 unit input power into the thermoelectric cooling module, the heat received by the cold side of the thermoelectric cooling module would be COPTEC×1; and the energy rejected by the hot side of the thermoelectric cooling module and to drive the ejector cooling device would be COPTEC+1. Thus, the cooling received by the low temperature evaporator of the ejector cooling device is COPEJ×(COPTEC+1); and therefore total COPTE-Ej-AC is COPEj+COPTEC+COPEj×COPTEC. In addition, the hybrid thermoelectric ejector active cooling system will be able to operate at higher temperature differentials than standalone thermoelectric cooling devices.