Thermoelectric Module With Folded Link Substrate
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Solution Overview
Problem
Conventional thermoelectric generators face challenges in producing high voltages at low temperature differences, requiring numerous thermoelectric elements connected in series, which leads to large, costly devices with mechanical stability and material wastage issues, and assembly complexities such as electrical shorting and inefficient heat flow paths.
Innovation Solution
A thermoelectric module comprising a continuous substrate with alternating n-type and p-type elements connected in series, featuring a link portion with bends or folds that allows for a compact, scalable, and cost-effective design by maximizing substrate area usage without additional insulating layers, enabling efficient heat flow and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a large number of thermoelectric elements are connected in series to achieve high voltage at low temperature differences, then the voltage output is improved, but the device size and cost increase
Solution Approach 1:
The patent implements nesting by stacking multiple substrates containing thermoelectric elements in a layered configuration, where each substrate contains an array of thermoelectric elements. The substrates are stacked vertically with thermal contact between corresponding elements, creating a nested structure that multiplies the effective number of series-connected elements without proportionally increasing the device footprint. This allows achieving high voltage output through the series connection of elements across multiple stacked layers while maintaining a compact overall device size.
Solution Approach 2:
The patent transitions from a planar two-dimensional arrangement of thermoelectric elements to a three-dimensional stacked configuration. By stacking substrates vertically, the invention exploits the third dimension (height/depth) to accommodate more thermoelectric elements in series connection without proportionally increasing the horizontal device area. This dimensional transition enables high voltage output while maintaining a compact footprint by distributing elements across multiple vertical layers.
2Quantity of substance
If the cross sectional area of thermoelectric elements is reduced to minimize material usage, then the amount of thermoelectric material is reduced, but mechanical stability deteriorates
Solution Approach 1:
The patent segments the mechanical support function from the thermoelectric active material by introducing a separate substrate structure. The substrate provides mechanical stability and structural integrity, while the thermoelectric elements can be made with reduced cross-sectional area for minimal material usage. The substrate acts as a scaffold that supports the thin thermoelectric elements, allowing them to maintain mechanical stability without requiring large cross-sectional areas, thus reducing the quantity of expensive thermoelectric material needed.
Solution Approach 2:
The patent creates a composite structure combining the substrate material (providing mechanical strength) with thermoelectric materials (providing thermoelectric functionality). This composite approach allows the thermoelectric elements to have reduced cross-sectional area since the substrate provides the necessary mechanical support. The combination enables minimal thermoelectric material usage while maintaining overall mechanical stability through the stronger substrate material.
3Quantity of substance
If substrates are stacked to achieve the required number of thermoelectric elements, then the number of elements is increased, but assembly complexity increases due to electrical shorting risks
Solution Approach 1:
The patent introduces thermal interface materials or insulating layers as intermediary elements between stacked substrates. These intermediaries serve dual functions: they ensure good thermal contact between corresponding thermoelectric elements on adjacent substrates while simultaneously providing electrical insulation to prevent shorting between the stacked layers. This intermediary layer simplifies assembly by allowing direct stacking of substrates without complex isolation structures, reducing assembly complexity while maintaining the required number of thermoelectric elements.
4Reliability
If standard processes are used to create thermoelectric modules, then manufacturing reliability is maintained, but material wastage in cutting operations increases
Solution Approach 1:
The patent applies preliminary action by pre-patterning the substrate with the required array of thermoelectric element locations and interconnect structures before depositing the thermoelectric materials. This pre-patterned substrate serves as a template that guides the subsequent material deposition and assembly processes, reducing the need for extensive cutting and trimming operations that would waste material. The substrate is prepared in advance with the correct geometry and interconnect layout, allowing thermoelectric elements to be deposited directly in their final positions with minimal material wastage while maintaining manufacturing reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of compact, high-voltage thermoelectric generators with improved mechanical stability and reduced material waste, scalable for various device sizes while maintaining efficient heat flow and electrical performance.
Implementation Method 1
A thermoelectric generator is an example of such an energy generating device, and can be used wherever there is a temperature difference
Implementation Method 2
a first region having disposed thereon alternating n-type and p-type thermoelectric elements connected in a first electrical series
Data Source
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AI summary
A thermoelectric device comprising: a continuous substrate comprising: a first region having disposed thereon alternating n-type and p-type thermoelectric materials connected in a first electrical series; a second region having disposed thereon alternating n-type and p-type thermoelectric materials connected in a second electrical series; and a link portion extending between the first region and the second region, the link portion having disposed thereon an electrical connection connecting the first electrical series and the second electrical series; wherein the continuous substrate comprises a first bend or fold between the first region and a first end of the link portion and a second bend or fold between a second end of the link portion and the second region.