Thermoelectric Generator for Semiconductor Heat Dissipation
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Solution Overview
Problem
The increasing heat dissipation challenges in semiconductor devices due to higher density and speed, leading to overheating issues, which existing solutions address inadequately by making devices bulky and complex with external cooling methods.
Innovation Solution
Incorporating a thermo electric generator device between or on top of the stacks of a semiconductor device to convert waste heat into electric power, which can be recycled back into the system, reducing the need for external cooling and maintaining device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If external cooling methods (heat exchangers and cooling fans) are added to semiconductor device packages, then heat dissipation capability is improved, but device size and system complexity increase
Solution Approach 1:
The patent merges the cooling function with the semiconductor device package itself by integrating heat exchanger structures into the package substrate. This consolidation eliminates the need for separate external cooling components, thereby improving heat dissipation capability while reducing system complexity and device size.
Solution Approach 2:
The package substrate is designed to serve multiple functions: it provides mechanical support for the semiconductor device and simultaneously acts as a heat exchanger for thermal management. This multi-functionality allows the same structure to handle both structural and thermal requirements, reducing the need for additional dedicated cooling components.
2Temperature
If external cooling methods (heat exchangers and cooling fans) are added to semiconductor device packages, then heat dissipation capability is improved, but device size increases
Solution Approach 1:
The cooling function is merged into the package substrate itself, eliminating the need for separate external cooling components. This integration allows heat dissipation capability to be improved without increasing device size, as the heat exchanger structures are incorporated within the existing package volume rather than adding external bulk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat dissipation without increasing device size or complexity, allowing for efficient heat removal and potential power reuse, enhancing semiconductor device functionality and reducing power consumption.
Implementation Method 1
a thermo electric generator device is disposed between stacks of a multiple level device... configured to generate a voltage by converting heat into electric power
Data Source
AI summary
A device and method wherein a thermo electric generator device is disposed between stacks of a multiple level device, or is provided on or under a die of a package and is conductively connected to the package. The thermo electric generator device is configured to generate a voltage by converting heat into electric power. The voltage which is generated by the thermo electric generator can be recycled back into the die itself, or to a higher-level unit in the system, even to a cooling fan.