Thermoelectric Conversion Structure with Heat-Blocking Layer
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Solution Overview
Problem
Existing heat dissipation methods using mechanical fans, heat pipes, or finned heat sinks are inefficient in cooling objects below room temperature, and thermoelectric devices face reduced efficiency due to interfacial contact resistance and heat backflow issues.
Innovation Solution
A thermoelectric conversion structure incorporating a thermoelectric element, electrodes, and electrically conductive heat-blocking layers, where the heat-blocking layer's thickness is optimized to allow electron tunneling while scattering phonons, maintaining electrical conductivity while reducing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thermoelectric element thickness is reduced, then the device can be more compact and integrated, but the interfacial contact resistance becomes a key factor that significantly modulates the device performance
Solution Approach 1:
The patent introduces an electrically conductive heat-blocking layer as an intermediary between the thermoelectric element and the electrode. This intermediate layer serves as a mediator that simultaneously blocks heat conduction (reducing thermal resistance) while maintaining electrical conductivity, thus resolving the performance degradation caused by reduced thermoelectric element thickness
Solution Approach 2:
The patent employs composite material structure by combining the thermoelectric element with the electrically conductive heat-blocking layer. This composite approach creates a multi-functional interface that addresses both thermal and electrical requirements, improving overall device performance despite reduced thermoelectric element dimensions
2Volume of moving object
If the thermoelectric element thickness is reduced, then the device can be more compact, but the thermal resistance makes heat backflow worsened
Solution Approach 1:
The electrically conductive heat-blocking layer acts as an intermediary barrier that specifically targets heat backflow. By positioning this layer at the critical interface, it blocks the reverse heat flow path while allowing forward heat dissipation, thus reducing energy loss from heat backflow
Solution Approach 2:
The patent applies local quality modification by introducing the heat-blocking layer specifically at the electrode-thermoelectric element interface where heat backflow occurs. This localized intervention addresses the heat backflow problem at its source without affecting the overall thermoelectric conversion efficiency
3Volume of moving object
If the thermoelectric element thickness is reduced, then the device can be more compact, but the electrical resistance cause joule heat reducing heat-dissipating efficiency
Solution Approach 1:
The electrically conductive heat-blocking layer serves as an intermediary that provides an alternative low-resistance electrical path while blocking thermal conduction. This mediator reduces the overall electrical resistance at the interface, thereby reducing joule heat generation and improving heat-dissipating efficiency
4Temperature
If thermoelectric device is used to cool objects below room temperature, then efficient cooling is achieved, but interfacial contact resistance and heat backflow reduce the efficiency
Solution Approach 1:
The electrically conductive heat-blocking layer acts as a mediator that enables the system to achieve temperatures below room temperature by blocking heat backflow at the interface. This intermediary prevents the heat sink heat from flowing back to the heat source side, maintaining the temperature gradient necessary for sub-ambient cooling
Solution Approach 2:
The patent applies preliminary anti-action by pre-establishing the heat-blocking layer at the interface before heat backflow can occur. This preventive measure blocks the harmful heat backflow pathway, allowing the thermoelectric device to efficiently maintain temperatures below room temperature
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the figure of merit (ZT) by improving thermoelectric conversion efficiency, allowing for effective heat dissipation below room temperature without hindering electrical conductivity, thus improving the overall thermal management.
Implementation Method 1
a thermoelectric device utilizing Peltier effect to automatically drive the transfer of heat in a certain direction
Implementation Method 2
the heat-blocking layer's thickness is optimized to allow electron tunneling while scattering phonons
Implementation Method 3
the heat-blocking layer's thickness is optimized to allow electron tunneling while scattering phonons
Implementation Method 4
The electrical resistance cause joule heat
Data Source
AI summary
The disclosure provides a thermoelectric conversion structure and its use in heat dissipation device. The thermoelectric conversion structure includes a thermoelectric element, a first electrode and an electrically conductive heat-blocking layer. The thermoelectric element includes a first end and a second end opposite to each other. The first electrode is located at the first end of the thermoelectric element. The electrically conductive heat-blocking layer is between the thermoelectric element and the first electrode.