Heat conversion device
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Solution Overview
Problem
Thermoelectric devices face limitations in heat conversion efficiency due to a fixed temperature differential between the heat absorption and heat emission portions, restricting their cooling and heating capabilities.
Innovation Solution
A heat conversion device that moves a part of the fluid passing through it to either the heat absorption or heat emission side, allowing for adjustment of the temperature differential between these portions, thereby enhancing thermoelectric efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fixed temperature differential is maintained between heat absorption and heat emission portions, then the thermoelectric device operates stably, but the cooling and heating temperature range is limited
Solution Approach 1:
The heat conversion device is divided into multiple independent heat conversion modules, each capable of operating with its own optimized temperature differential. This segmentation allows different portions of the device to operate at different temperature ranges, expanding the overall cooling and heating temperature capability without requiring a complete redesign of the entire system.
Solution Approach 2:
The patent implements dynamic fluid flow control that adjusts the flow rate and distribution of the heat conversion medium based on operational requirements. By making the fluid flow characteristics variable rather than fixed, the system can adapt the temperature differential in real-time, enabling broader temperature ranges while maintaining stable operation through active control mechanisms.
2Loss of energy
If the temperature differential between heat absorption and heat emission portions is increased, then thermoelectric efficiency improves, but the influence of outdoor air temperature becomes more significant
Solution Approach 1:
The patent introduces a heat emission portion with enhanced heat dissipation capabilities that acts as an intermediary between the thermoelectric element and the outdoor environment. This intermediary structure, potentially including heat sinks or passive heat rejection mechanisms, buffers the direct influence of outdoor air temperature fluctuations, allowing the device to maintain higher temperature differentials and improved efficiency while being less susceptible to environmental temperature variations.
3Ease of operation
If fluid flow rate is increased to improve heat transfer, then temperature control capability improves, but energy consumption increases
Solution Approach 1:
The patent implements variable flow rate control that adjusts the fluid flow rate locally based on the specific thermal requirements of different heat conversion modules. Rather than maintaining a high uniform flow rate throughout the entire system, the control mechanism directs higher flow rates only to portions of the system where maximum temperature control capability is needed, while reducing flow rates in other portions, thereby achieving effective temperature control with reduced overall energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables increased cooling or heating temperatures, improving the overall efficiency of thermoelectric devices by maximizing the temperature differential, allowing for more effective temperature control.
Implementation Method 1
When a temperature difference is provided between the materials of this PN junction pair, electric power is generated by the Seebeck effect
Implementation Method 2
the thermoelectric element may be used as a temperature controlling device by the Peltier effect in which one material of the PN junction pair is cooled and the other material is heated
Data Source
Figure 1~2
Figure 3(A)~3(B)
Figure 4(A)~4(B)
AI summary
Provided is a heat conversion device, including: a housing (300); a thermoelectric module (100) received in the housing (300) and including a thermoelectric semiconductor (120) between substrates (140 ; 150) disposed to face each other; a first temperature conversion portion (200a) and a second temperature conversion portion (200b) disposed between the substrates (140 ; 150), respectively; and a heat reduction portion (400) adopted to guide a part of a fluid flowing in the housing (300) and passing through the first temperature conversion portion (200a) to the second temperature conversion portion (200b).