Thermoelectric Material Integrated Circuit Repackaging Detection
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Solution Overview
Problem
Current methods for detecting repackaging of integrated circuits are costly and require post facto optical or X-ray analysis, making them inefficient and expensive.
Innovation Solution
Incorporating thermoelectric materials in regions exposed to temperature gradients during packaging, which generate electrical energy detectable during repackaging, allowing for automatic and self-contained detection, and enabling the integrated circuit to be disabled if repackaging is detected.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If optical or X-ray analysis is used to detect repackaging, then detection accuracy is improved, but cost increases significantly
Solution Approach 1:
The integrated circuit performs self-detection of repackaging through its own thermoelectric material and associated circuitry. The detection system is built into the IC itself, eliminating the need for external optical or X-ray analysis equipment, thereby reducing detection costs while maintaining accuracy.
Solution Approach 2:
The patent replaces complex external optical or X-ray analysis systems with a simple electrical detection system based on thermoelectric effect. The thermoelectric material converts thermal energy from repackaging processes into detectable electrical signals, substituting expensive imaging equipment with affordable electrical measurement circuitry.
2Difficulty of detecting and measuring
If post facto analysis is used to detect repackaging, then detection capability is achieved, but time loss increases
Solution Approach 1:
The thermoelectric material is pre-installed within the integrated circuit during manufacturing, and the detection system is activated before repackaging occurs. The system continuously monitors for thermal signatures of repackaging, enabling real-time detection rather than post-facto analysis, thus eliminating time loss.
3Measurement precision
If thermoelectric material is installed in the interconnect part, then detection sensitivity is improved, but device complexity increases
Solution Approach 1:
The thermoelectric material is integrated into the existing interconnect structure of the integrated circuit, merging the detection function with the electrical interconnection system. This consolidation adds detection capability without requiring separate structural components, thereby minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective, real-time detection of repackaging by converting thermal energy into electrical energy, allowing for immediate identification and potential deactivation of the integrated circuit.
Implementation Method 1
Specifically, a thermoelectric material therefore enables electrical energy, and more precisely an electrical current, to be produced as a result of the thermal gradient to which it is exposed.
Data Source
AI summary
An integrated circuit includes active circuitry disposed at a surface of a semiconductor body and an interconnect region disposed above the semiconductor body. A thermoelectric material is disposed in an upper portion of the interconnect region away from the semiconductor body. The thermoelectric material is configured to deliver electrical energy when exposed to a temperature gradient. This material can be used, for example, in a method for detecting the repackaging of the integrated circuit after it has been originally packaged.