Thermoelectric Devices With Insulating Matrix Between Traces
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Solution Overview
Problem
Current thermoelectric devices using bulk materials like p-BixSb2-xTe3 and n-Bi2Te3-xSex alloys exhibit relatively poor performance due to low figures-of-merit (ZT) and coefficients of performance (COP), limiting their effectiveness in applications such as electronics and sensors.
Innovation Solution
A method of forming thermoelectric devices involves creating patterns of conductive traces on a substrate, coupling thermoelectric elements to these traces with an electrically insulating matrix, and using metal posts for mechanical support, allowing for improved thermal and electrical coupling without a separate insulating header, enhancing the device's performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If bulk thermoelectric materials like p-BixSb2-xTe3 and n-Bi2Te3-xSex alloys are used, then the device structure is simple, but the figure-of-merit (ZT) and coefficient of performance (COP) are low resulting in poor thermoelectric device performance
Solution Approach 1:
The patent divides the bulk thermoelectric material into thin-film layers deposited on a substrate with conductive traces. This segmentation allows for better thermal coupling and electrical connection while maintaining structural simplicity. The thin-film approach enables more precise control over thermal and electrical properties compared to bulk materials.
Solution Approach 2:
The patent introduces an electrically insulating matrix as an intermediary between the conductive traces and the thermoelectric elements. This matrix provides mechanical support and thermal coupling while preventing electrical shorting, thereby improving overall device performance without significantly increasing complexity.
2Reliability
If an electrically insulating matrix is formed between conductive traces, then thermal coupling and mechanical support are improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent combines multiple functions into the electrically insulating matrix: it provides electrical insulation, mechanical support, and thermal coupling simultaneously. This merging of functions improves thermal coupling and structural integrity while minimizing the increase in manufacturing complexity, as the matrix can be formed as a single integrated component during the fabrication process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves thermal coupling and mechanical support, leading to enhanced thermoelectric device performance by optimizing the arrangement of thermoelectric elements and conductive traces, thereby increasing the efficiency of thermoelectric energy conversion and cooling capabilities.
Implementation Method 1
Thermoelectric materials may be used to provide cooling and/or power generation according to the Peltier effect.
Implementation Method 2
where α, T, σ, KT are the Seebeck coefficient, absolute temperature, electrical conductivity, and total thermal conductivity, respectively.
Data Source
AI summary
A method of forming a thermoelectric device may include forming a pattern of conductive traces, and forming an electrically insulating matrix between the conductive traces of the pattern of conductive traces. In addition, a plurality of thermoelectric elements may be electrically and mechanically coupled to the pattern of conductive traces so that each conductive trace of the pattern of conductive traces has one of the plurality of thermoelectric elements thereon. In addition, the plurality of thermoelectric elements may be free of the electrically insulating matrix. Related methods and structures are also discussed.