Thermoelectric Liquid Cooling Loop for High-Power Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional air cooling methods are inadequate for managing heat in electronic devices with high power density, leading to increased device temperatures and potential thermal runaway, especially in densely packed circuits where traditional heat sinks with heat pipes or vapor chambers are insufficient.
Innovation Solution
A cooling apparatus comprising a liquid-cooled structure, a coolant loop, a liquid-to-liquid heat exchanger, an air-to-liquid heat exchanger, and a thermoelectric array, which couples electronic components to a coolant loop that transfers heat through series-connected heat exchangers, allowing either the liquid-to-liquid or air-to-liquid heat exchanger to operate as a heat sink based on operational mode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional air cooling methods are used, then device simplicity is maintained, but heat removal capability is insufficient for high power density devices
Solution Approach 1:
The cooling system is segmented into multiple functional components: a liquid-cooled structure with coolant loop for primary heat removal, a thermoelectric array for active cooling enhancement, and heat exchangers for thermal management. This segmentation allows each component to address specific thermal challenges, enabling effective heat removal from high power density devices while maintaining manageable system complexity through modular design.
2Temperature
If heat removal capacity is increased to manage high power density, then temperature control improves, but device complexity increases
Solution Approach 1:
The patent merges liquid cooling and thermoelectric cooling into a single integrated system. The liquid-cooled structure and thermoelectric array work together synergistically, with the thermoelectric array enhancing the cooling capacity of the liquid cooling system. This combination allows the system to handle high power density heat loads effectively while avoiding the complexity of completely separate cooling systems.
Solution Approach 2:
The cooling apparatus is designed with multi-functionality to address various thermal management needs. The thermoelectric array can operate in different modes (cooling, heating, power generation) depending on system requirements, and the heat exchangers can serve multiple purposes including cooling the coolant and managing ambient thermal conditions. This universality reduces the need for multiple specialized components.
3Productivity
If liquid cooling is implemented, then heat removal efficiency increases, but reliance on traditional air cooling decreases
Solution Approach 1:
The cooling system incorporates dynamic control capabilities through the thermoelectric array, which can be adjusted in real-time based on thermal conditions and power requirements. The system can dynamically switch between different cooling modes and adjust the intensity of cooling applied to different regions, providing adaptability while maintaining high heat removal efficiency through liquid cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat in high-power electronic devices by utilizing a liquid-cooled structure and thermoelectric array to maintain desirable temperatures, reducing the reliance on traditional air cooling methods and enhancing cooling efficiency.
Implementation Method 1
The thermoelectric array operates to transfer heat from the coolant passing through the first loop portion to coolant passing through the second loop portion
Implementation Method 2
The liquid-to-liquid heat exchanger and the air-to-liquid heat exchanger are coupled in series fluid communication via the coolant loop
Data Source
AI summary
Thermoelectric-enhanced air and liquid cooling of an electronic system is provided by a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.